IC & COMPONENT SOCKET, 64 CONTACTS, QFN TEST SOCKET, 0.5 MM, 264 SERIES, BERYLLIUM COPPER
| Part | Termination Post Length [x] | Termination Post Length [x] | Mounting Type | Number of Positions or Pins (Grid) | Contact Resistance | Contact Finish - Mating | Housing Material | Type | Termination | Contact Material - Mating | Pitch - Post | Pitch - Post | Contact Material - Post | Contact Finish - Post | Features | Pitch - Mating | Pitch - Mating | Termination Post Length | Termination Post Length | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Type | Type | Current Rating (Amps) | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Operating Temperature [Min] | Operating Temperature [Max] | Material Flammability Rating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
2.9 mm | 0.114 in | Through Hole | 64 | 25 mOhm | Gold | Polyethersulfone (PES) | QFN | Solder | Beryllium Copper | 0.02 in | 0.5 mm | Beryllium Copper | Gold | Open Frame | 0.02 in | 0.5 mm | |||||||||||||
Connector | 64 | Gold | Polysulfone (PSU), Glass Filled | DIP, ZIF (ZIP) | Press-Fit | Beryllium Copper | 0.1 in | 2.54 mm | Beryllium Copper | Gold | Closed Frame | 0.1 in | 2.54 mm | 0.11 in | 2.78 mm | 30 µin | 0.76 µm | 22.86 mm | 0.9 in | 1 A | 30 Áin | 0.76 Ám | -55 °C | 125 °C | UL94 V-0 | ||||
Connector | 64 | 15 mOhm | Gold | Polysulfone (PSU), Glass Filled | DIP, ZIF (ZIP) | Press-Fit | Beryllium Copper | 0.07 in | 1.78 mm | Beryllium Copper | Gold | Closed Frame | 0.07 in | 1.78 mm | 0.11 in | 2.78 mm | 30 µin | 0.76 µm | 22.86 mm | 0.9 in | 1 A | 30 Áin | 0.76 Ám | -55 °C | 125 °C | UL94 V-0 | |||