
RSX205L-30TE25
NRNDRohm Semiconductor
HIGH EFFICIENCY , HIGH RELIABILITY TYPE SCHOTTKY BARRIER DIODE

RSX205L-30TE25
NRNDRohm Semiconductor
HIGH EFFICIENCY , HIGH RELIABILITY TYPE SCHOTTKY BARRIER DIODE
Description
General part information
RSX205L-30 Series
ROHM's schottky barrier diodes are low VF, low IR and high ESD resistant, suitable for PC,mobile phone and various portable electronics.
Technical Specifications
Parameters and characteristics for this part
| Specification | RSX205L-30TE25 |
|---|---|
| Current - Average Rectified (Io) | 2 A |
| Current - Reverse Leakage | 200 µA |
| Mounting Type | Surface Mount |
| Operating Temperature - Junction | 150 °C |
| Package / Case | SMA, DO-214AC |
| Package Name | PMDS |
| Speed - Fast Recovery (Maximum) | 500 ns |
| Speed - Fast Recovery (Minimum) | 200 mA |
| Technology | Schottky |
| Voltage - DC Reverse (Vr) (Max) | 30 V |
| Voltage - Forward (Vf) (Max) | 490 mV |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
θ<sub>JC</sub> and Ψ<sub>JT</sub>
Report of SVHC under REACH Regulation
About Export Regulations
PCB Layout Thermal Design Guide
What Is Thermal Design
How to Use the Thermal Resistance and Thermal Characteristics Parameters
How to Select Reverse Current Protection Diodes for LDO Regulators
Compliance of the RoHS directive
List of Diode Package Thermal Resistance
What is a Thermal Model? (Diode)
About Flammability of Materials
ROHM's SBD Lineup Contributes to Greater Miniaturization and Lower Loss in Automotive, Industrial, and Consumer Equipment
Judgment Criteria of Thermal Evaluation
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
Inner Structure
Constitution Materials List
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
Two-Resistor Model for Thermal Simulation
Measurement Method and Usage of Thermal Resistance RthJC
Moisture Sensitivity Level - Diodes
Impedance Characteristics of Bypass Capacitor
How to Use LTspice® Models: Tips for Improving Convergence
Part Explanation
Anti-Whisker formation - Diodes
RSX205L-30 Data Sheet
Notes for Temperature Measurement Using Thermocouples
Absolute Maximum Rating and Electrical Characteristics of Diodes
Taping Information
Explanation for Marking
Basics of Thermal Resistance and Heat Dissipation
Notes for Temperature Measurement Using Forward Voltage of PN Junction
How to Select Rectifier Diodes
Condition of Soldering / Land Pattern Reference
How to Create Symbols for PSpice Models
Reliability Test Result
Power Loss and Thermal Design of Diodes
Diode Types and Applications
Package Dimensions
θ<sub>JA</sub> and Ψ<sub>JT</sub>
Method for Monitoring Switching Waveform
ESD Data
Importance of Probe Calibration When Measuring Power: Deskew
Notes for Calculating Power Consumption:Static Operation
Diode Selection Method for Asynchronous Converter
How to Use LTspice® Models
Precautions When Measuring the Rear of the Package with a Thermocouple
RSX205L-30TE25 | Datasheet