XG8T-0431

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Omron Electronics Inc-EMC Div

CONN HEADER VERT 4POS 2.54MM

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XG8T-0431

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Omron Electronics Inc-EMC Div

CONN HEADER VERT 4POS 2.54MM

Deep-Dive with AI

DocumentsDatasheet How to Read Date Codes

Specifications Pricing Series Description Documents

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	1	$ 0.44
		10	$ 0.38
		100	$ 0.31
		1000	$ 0.22
		5000	$ 0.20
		10000	$ 0.18

Description

General part information

XG8T Series

Connector Header Through Hole 4 position 0.100" (2.54mm)

Documents

Technical documentation and resources

Datasheet

How to Read Date Codes

Technical Specifications

Parameters and characteristics commom to parts in this series

Specification	XG8T-0431	XG8T Series

Connector Type	Header	Header
Contact Finish - Mating	Gold	Gold
Contact Finish - Post	Gold	Tin, Gold
Contact Finish Thickness - Mating	0.15 µm	0.15 µm
Contact Finish Thickness - Mating	5.9 µin	5.9 µin
Contact Finish Thickness - Post	0.15 µm	0.15 µm
Contact Finish Thickness - Post	5.9 µin	5.9 µin
Contact Length - Mating [x]	4.3 mm	4.3 mm
Contact Length - Mating [x]	0.169 in	0.169 in
Contact Length - Post	0.118 in	0.118 in
Contact Length - Post	3 mm	3 mm
Contact Material	Brass, Nickel	Brass, Nickel
Contact Shape	Square	Square
Contact Type	Male Pin	Male Pin
Current Rating (Amps)	2 A	2 A
Fastening Type	Push-Pull	Push-Pull
Insulation Color	Black	Black
Insulation Height [z]	0.098 in	0.098 in
Insulation Height [z]	2.5 mm	2.5 mm
Insulation Material	Polybutylene Terephthalate (PBT), Glass Filled	Polybutylene Terephthalate (PBT), Glass Filled
Material Flammability Rating	UL94 V-0	UL94 V-0
Mounting Type	Through Hole	Through Hole
Number of Positions	4	4 - 18
Number of Positions Loaded	All	All
Number of Rows	2	2
Operating Temperature [Max]	105 ░C	105 ░C
Operating Temperature [Min]	-55 °C	-55 °C
Overall Contact Length	9.8 mm	9.8 mm
Overall Contact Length	0.386 in	0.386 in
Pitch - Mating	0.1 in	0.1 in
Pitch - Mating	2.54 mm	2.54 mm
Row Spacing - Mating [x]	2.54 mm	2.54 mm
Row Spacing - Mating [x]	0.1 in	0.1 in
Shrouding	Unshrouded	Unshrouded
Style	Board to Board, Cable	Board to Board, Cable
Termination	Solder	Solder
Voltage Rating	300 VDC	300 VDC

XG8T Series

CONN HEADER VERT 18POS 2.54MM

Part	Operating Temperature [Max]	Operating Temperature [Min]	Connector Type	Row Spacing - Mating [x]	Row Spacing - Mating [x]	Contact Material	Voltage Rating	Contact Type	Insulation Material	Contact Shape	Insulation Color	Pitch - Mating	Pitch - Mating	Termination	Shrouding	Number of Rows	Insulation Height [z]	Insulation Height [z]	Number of Positions Loaded	Current Rating (Amps)	Contact Length - Post	Contact Length - Post	Mounting Type	Overall Contact Length	Overall Contact Length	Material Flammability Rating	Contact Length - Mating [x]	Contact Length - Mating [x]	Fastening Type	Contact Finish - Post	Style	Number of Positions	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post
Omron Electronics Inc-EMC Div XG8T-1841	105 ░C	-55 °C	Header	2.54 mm	0.1 in	Brass, Nickel	300 VDC	Male Pin	Polybutylene Terephthalate (PBT), Glass Filled	Square	Black	0.1 in	2.54 mm	Solder	Unshrouded	2	0.098 in	2.5 mm	All	2 A	0.118 in	3 mm	Through Hole	9.8 mm	0.386 in	UL94 V-0	4.3 mm	0.169 in	Push-Pull	Tin	Board to Board, Cable	18
Omron Electronics Inc-EMC Div XG8T-0441	105 ░C	-55 °C	Header	2.54 mm	0.1 in	Brass, Nickel	300 VDC	Male Pin	Polybutylene Terephthalate (PBT), Glass Filled	Square	Black	0.1 in	2.54 mm	Solder	Unshrouded	2	0.098 in	2.5 mm	All	2 A	0.118 in	3 mm	Through Hole	9.8 mm	0.386 in	UL94 V-0	4.3 mm	0.169 in	Push-Pull	Tin	Board to Board, Cable	4
Omron Electronics Inc-EMC Div XG8T-0631	105 ░C	-55 °C	Header	2.54 mm	0.1 in	Brass, Nickel	300 VDC	Male Pin	Polybutylene Terephthalate (PBT), Glass Filled	Square	Black	0.1 in	2.54 mm	Solder	Unshrouded	2	0.098 in	2.5 mm	All	2 A	0.118 in	3 mm	Through Hole	9.8 mm	0.386 in	UL94 V-0	4.3 mm	0.169 in	Push-Pull	Gold	Board to Board, Cable	6	0.15 µm	5.9 µin	Gold	0.15 µm	5.9 µin
Omron Electronics Inc-EMC Div XG8T-0431	105 ░C	-55 °C	Header	2.54 mm	0.1 in	Brass, Nickel	300 VDC	Male Pin	Polybutylene Terephthalate (PBT), Glass Filled	Square	Black	0.1 in	2.54 mm	Solder	Unshrouded	2	0.098 in	2.5 mm	All	2 A	0.118 in	3 mm	Through Hole	9.8 mm	0.386 in	UL94 V-0	4.3 mm	0.169 in	Push-Pull	Gold	Board to Board, Cable	4	0.15 µm	5.9 µin	Gold	0.15 µm	5.9 µin
Omron Electronics Inc-EMC Div XG8T-0841	105 ░C	-55 °C	Header	2.54 mm	0.1 in	Brass, Nickel	300 VDC	Male Pin	Polybutylene Terephthalate (PBT), Glass Filled	Square	Black	0.1 in	2.54 mm	Solder	Unshrouded	2	0.098 in	2.5 mm	All	2 A	0.118 in	3 mm	Through Hole	9.8 mm	0.386 in	UL94 V-0	4.3 mm	0.169 in	Push-Pull	Tin	Board to Board, Cable	8
Omron Electronics Inc-EMC Div XG8T-1041	105 ░C	-55 °C	Header	2.54 mm	0.1 in	Brass, Nickel	300 VDC	Male Pin	Polybutylene Terephthalate (PBT), Glass Filled	Square	Black	0.1 in	2.54 mm	Solder	Unshrouded	2	0.098 in	2.5 mm	All	2 A	0.118 in	3 mm	Through Hole	9.8 mm	0.386 in	UL94 V-0	4.3 mm	0.169 in	Push-Pull	Tin	Board to Board, Cable	10
Omron Electronics Inc-EMC Div XG8T-1441	105 ░C	-55 °C	Header	2.54 mm	0.1 in	Brass, Nickel	300 VDC	Male Pin	Polybutylene Terephthalate (PBT), Glass Filled	Square	Black	0.1 in	2.54 mm	Solder	Unshrouded	2	0.098 in	2.5 mm	All	2 A	0.118 in	3 mm	Through Hole	9.8 mm	0.386 in	UL94 V-0	4.3 mm	0.169 in	Push-Pull	Tin	Board to Board, Cable	14
Omron Electronics Inc-EMC Div XG8T-0831	105 ░C	-55 °C	Header	2.54 mm	0.1 in	Brass, Nickel	300 VDC	Male Pin	Polybutylene Terephthalate (PBT), Glass Filled	Square	Black	0.1 in	2.54 mm	Solder	Unshrouded	2	0.098 in	2.5 mm	All	2 A	0.118 in	3 mm	Through Hole	9.8 mm	0.386 in	UL94 V-0	4.3 mm	0.169 in	Push-Pull	Gold	Board to Board, Cable	8	0.15 µm	5.9 µin	Gold	0.15 µm	5.9 µin
Omron Electronics Inc-EMC Div XG8T-1241	105 ░C	-55 °C	Header	2.54 mm	0.1 in	Brass, Nickel	300 VDC	Male Pin	Polybutylene Terephthalate (PBT), Glass Filled	Square	Black	0.1 in	2.54 mm	Solder	Unshrouded	2	0.098 in	2.5 mm	All	2 A	0.118 in	3 mm	Through Hole	9.8 mm	0.386 in	UL94 V-0	4.3 mm	0.169 in	Push-Pull	Tin	Board to Board, Cable	12
Omron Electronics Inc-EMC Div XG8T-1831	105 ░C	-55 °C	Header	2.54 mm	0.1 in	Brass, Nickel	300 VDC	Male Pin	Polybutylene Terephthalate (PBT), Glass Filled	Square	Black	0.1 in	2.54 mm	Solder	Unshrouded	2	0.098 in	2.5 mm	All	2 A	0.118 in	3 mm	Through Hole	9.8 mm	0.386 in	UL94 V-0	4.3 mm	0.169 in	Push-Pull	Gold	Board to Board, Cable	18	0.15 µm	5.9 µin	Gold	0.15 µm	5.9 µin