H2UE6P1K2R0100

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Unictron Technologies Corporation

GSM 3G CHIP 824-960 1710-2170 MH

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Unictron Technologies Corporation

GSM 3G CHIP 824-960 1710-2170 MH

Technical Specifications

Parameters and characteristics for this part

GSM 3G CHIP 824-960 1710-2170 MH

Part	Antenna Type	Height (Max) [Max]	Height (Max)	VSWR	Applications	Mounting Type	Frequency Range [Min]	Frequency Range [Max]	RF Family/Standard	Frequency (Center/Band)	Number of Bands	Gain	Termination	Power - Max [Max]
Unictron Technologies Corporation H2UE6P1K2R0100	Chip	0.126 in	3.2 mm	3	3G, GSM	Surface Mount	1.71 GHz, 824 MHz	2.17 GHz, 960 MHz	Cellular	1.94 GHz, 892 MHz	2	1.7 dBi, 2.9 dBi	Solder	2 W

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

RF ANTENNA 3G, GSM Chip Solder Surface Mount

Technical documentation and resources