Zenode.ai Logo
Beta
K

08-3503-20

Active
Aries Electronics

CONN IC DIP SOCKET 8POS GOLD

Deep-Dive with AI

Search across all available documentation for this part.

DocumentsDatasheet

08-3503-20

Active
Aries Electronics

CONN IC DIP SOCKET 8POS GOLD

Deep-Dive with AI

DocumentsDatasheet

Technical Specifications

Parameters and characteristics for this part

Specification08-3503-20
Contact Finish - MatingGold
Contact Finish - PostTin
Contact Finish Thickness - Mating10 çin
Contact Finish Thickness - Mating0.25 çm
Contact Finish Thickness - Post200 µin
Contact Finish Thickness - Post5.08 µm
Contact Material - MatingBeryllium Copper
Contact Material - PostPhosphor Bronze
Current Rating (Amps)3 A
FeaturesClosed Frame
Housing MaterialGlass Filled, Polyamide (PA46), Nylon 4/6
Material Flammability RatingUL94 V-0
Mounting TypeThrough Hole
Number of Positions or Pins (Grid)8
Operating Temperature [Max]105 ░C
Operating Temperature [Min]-55 °C
Pitch - Mating0.1 in
Pitch - Mating2.54 mm
Pitch - Post2.54 mm
Pitch - Post0.1 in
TerminationWire Wrap
Termination Post Length [x]0.36 in
Termination Post Length [x]9.14 mm
Type0.3 "
Type7.62 mm
TypeDIP

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyBulk 151$ 3.35

Description

General part information

08-3503 Series

8 (2 x 4) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole

Documents

Technical documentation and resources