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26-6621-30

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Aries Electronics

CONN IC DIP SOCKET 26POS TIN

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26-6621-30

Active
Aries Electronics

CONN IC DIP SOCKET 26POS TIN

Deep-Dive with AI

DocumentsDatasheet

Technical Specifications

Parameters and characteristics for this part

Specification26-6621-30
Contact Finish - PostTin
Contact Finish Thickness - Mating5.08 µm
Contact Finish Thickness - Mating200 µin
Contact Finish Thickness - Post200 µin
Contact Finish Thickness - Post5.08 µm
Contact Material - MatingPhosphor Bronze
Contact Material - PostPhosphor Bronze
Current Rating (Amps)1.5 A
FeaturesClosed Frame
Housing MaterialGlass Filled, Polyamide (PA46), Nylon 4/6
Material Flammability RatingUL94 V-0
Mounting TypeThrough Hole, Bottom Entry, Through Board
Operating Temperature [Max]105 ░C
Operating Temperature [Min]-55 °C
Pitch - Mating0.1 in
Pitch - Mating2.54 mm
Pitch - Post2.54 mm
Pitch - Post0.1 in
TerminationSolder
Termination Post Length0.15 in
Termination Post Length3.81 mm
TypeDIP
Type0.6 in
Type15.24 mm

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyBulk 26$ 14.46

Description

General part information

26-6621 Series

26 (2 x 13) Pos DIP, 0.6" (15.24mm) Row Spacing Socket Tin Through Hole, Bottom Entry; Through Board

Documents

Technical documentation and resources