Specification	SEAFP-20-01-S-08-RA-WT

Connector Type	High Density Array, FEMALE
Contact Finish	Gold
Contact Finish Thickness	30 µin
Features	Solder Retention
Mounting Type	Through Hole, Press-Fit, Right Angle
Number of Positions	160
Number of Rows	8
Pitch	0.05 in

SEAFP Series

Part	Height Above Board	Mated Stacking Height	Contact Finish Thickness	Connector Type	Number of Rows	Number of Positions	Pitch	Mounting Type	Contact Finish	Features
Samtec Inc. SEAFP-50-05.0-L-04-TR	0.197 in	7 mm	10 Ąin	FEMALE High Density Array	4	200	0.05 in	Through Hole	Gold
Samtec Inc. SEAFP-20-01-S-08-RA-WT			30 µin	FEMALE High Density Array	8	160	0.05 in	Press-Fit Right Angle Through Hole	Gold	Solder Retention

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