UJA1169ATK/X/FZ

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NXP USA Inc.

IC MINI-CAN SYSTEM BASIS CHIP

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NXP USA Inc.

IC MINI-CAN SYSTEM BASIS CHIP

Technical Specifications

Parameters and characteristics commom to parts in this series

IC MINI-CAN SYSTEM BASIS CHIP

Part	Applications	Interface	Voltage - Supply [Max]	Voltage - Supply [Min]	Supplier Device Package	Supplier Device Package [x]	Supplier Device Package [y]	Package / Case	Mounting Type
NXP USA Inc. UJA1169ATK/F/3Z	System Basis Chip	CAN, SPI	28 V	3 V	20-HVSON	3.5	5.5	20-VFDFN Exposed Pad	Surface Mount
NXP USA Inc. UJA1169LTK/XZ	System Basis Chip	CAN			20-HVSON	3.5	5.5	20-VFDFN Exposed Pad	Surface Mount
NXP USA Inc. UJA1169ATK/F/3	System Basis Chip	CAN			20-HVSON	3.5	5.5	20-VFDFN Exposed Pad	Surface Mount
NXP USA Inc. UJA1169ATK/X/FZ	System Basis Chip	CAN, SPI	28 V	3 V	20-HVSON	3.5	5.5	20-VFDFN Exposed Pad	Surface Mount
NXP USA Inc. UJA1169ATK/XZ	System Basis Chip	CAN, SPI	28 V	3 V	20-HVSON	3.5	5.5	20-VFDFN Exposed Pad	Surface Mount
NXP USA Inc. UJA1169ATK/3Z	System Basis Chip	CAN, SPI	28 V	3 V	20-HVSON	3.5	5.5	20-VFDFN Exposed Pad	Surface Mount
NXP USA Inc. UJA1169ATKZ	System Basis Chip	CAN, SPI	28 V	3 V	20-HVSON	3.5	5.5	20-VFDFN Exposed Pad	Surface Mount
NXP USA Inc. UJA1169LTK/FZ	System Basis Chip	CAN			20-HVSON	3.5	5.5	20-VFDFN Exposed Pad	Surface Mount
NXP USA Inc. UJA1169ATK/FZ	System Basis Chip	CAN, SPI	28 V	3 V	20-HVSON	3.5	5.5	20-VFDFN Exposed Pad	Surface Mount

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

System Basis Chip Interface 20-HVSON (3.5x5.5)

Technical documentation and resources