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PA0026C

PA0026C

Active
Chip Quik Inc.

UMAX-8/USOP-8/MSOP-8 TO DIP-8 SM

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PA0026C

PA0026C

Active
Chip Quik Inc.

UMAX-8/USOP-8/MSOP-8 TO DIP-8 SM

Find alt

Description

General part information

PA0026 Series

UMAX-8/USOP-8/MSOP-8 TO DIP-8 SM

Technical Specifications

Parameters and characteristics for this part

SpecificationPA0026C
Board Thickness0.063 in
MaterialFR4 Epoxy Glass
Number of Positions8
Package AccepteduSOP, uMAX, MSOP
Pitch0.026 in
Proto Board TypeSMD, DIP
Size / Dimension Length0.4 in
Size / Dimension Width0.4 in

Pricing

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CAD

3D models and CAD resources for this part

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