GD25LE128E3IRR

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GigaDevice Semiconductor (HK) Limited

IC FLSH 128MBIT SPI/QUAD 26WLCSP

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GD25LE128E3IRR

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GigaDevice Semiconductor (HK) Limited

IC FLSH 128MBIT SPI/QUAD 26WLCSP

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Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	GD25LE128E3IRR

Access Time	6 ns
Clock Frequency	133 MHz
Memory Format	FLASH
Memory Interface	Quad I/O, QPI, SPI
Memory Organization	16M x 8
Memory Size	128 Mb
Memory Type	Non-Volatile
Mounting Type	Surface Mount
Operating Temperature [Max]	85 °C
Operating Temperature [Min]	-40 °C
Package / Case	WLCSP, 26-XFBGA
Supplier Device Package	26-WLCSP
Technology	FLASH - NOR (SLC)
Voltage - Supply [Max]	2 V
Voltage - Supply [Min]	1.65 V
Write Cycle Time - Word, Page [custom]	60 µs
Write Cycle Time - Word, Page [custom]	2.4 ms

GD25LE128 Series

Part	Technology	Supplier Device Package	Memory Format	Operating Temperature [Max]	Operating Temperature [Min]	Package / Case	Access Time	Memory Type	Clock Frequency	Voltage - Supply [Max]	Voltage - Supply [Min]	Memory Organization	Write Cycle Time - Word, Page [custom]	Write Cycle Time - Word, Page [custom]	Memory Interface	Memory Size	Mounting Type	Package / Case [y]	Package / Case [x]
GigaDevice Semiconductor (HK) Limited GD25LE128EWIGR	FLASH - NOR (SLC)	8-WSON (5x6)	FLASH	85 °C	-40 °C	8-WDFN Exposed Pad	6 ns	Non-Volatile	133 MHz	2 V	1.65 V	16M x 8	60 µs	2.4 ms	QPI Quad I/O SPI	128 Mb	Surface Mount
GigaDevice Semiconductor (HK) Limited GD25LE128ELIGR	FLASH - NOR (SLC)	16-WLCSP	FLASH	85 °C	-40 °C	16-XFBGA WLCSP	6 ns	Non-Volatile	133 MHz	2 V	1.65 V	16M x 8	60 µs	2.4 ms	QPI Quad I/O SPI	128 Mb	Surface Mount
GigaDevice Semiconductor (HK) Limited GD25LE128EWJGY	FLASH - NOR (SLC)	8-WSON (5x6)	FLASH	105 °C	-40 °C	8-WDFN Exposed Pad	6 ns	Non-Volatile	133 MHz	2 V	1.65 V	16M x 8	60 µs	2.4 ms	QPI Quad I/O SPI	128 Mb	Surface Mount
GigaDevice Semiconductor (HK) Limited GD25LE128EQIGR	FLASH - NOR (SLC)	8-USON (4x4)	FLASH	85 °C	-40 °C	8-XDFN Exposed Pad	6 ns	Non-Volatile	133 MHz	2 V	1.65 V	16M x 8	60 µs	2.4 ms	QPI Quad I/O SPI	128 Mb	Surface Mount
GigaDevice Semiconductor (HK) Limited GD25LE128ESIGR	FLASH - NOR (SLC)	8-SOP	FLASH	85 °C	-40 °C	8-SOIC	6 ns	Non-Volatile	133 MHz	2 V	1.65 V	16M x 8	60 µs	2.4 ms	QPI Quad I/O SPI	128 Mb	Surface Mount	5.3 mm	0.209 "
GigaDevice Semiconductor (HK) Limited GD25LE128E3IRR	FLASH - NOR (SLC)	26-WLCSP	FLASH	85 °C	-40 °C	26-XFBGA WLCSP	6 ns	Non-Volatile	133 MHz	2 V	1.65 V	16M x 8	60 µs	2.4 ms	QPI Quad I/O SPI	128 Mb	Surface Mount
GigaDevice Semiconductor (HK) Limited GD25LE128EWJGR	FLASH - NOR (SLC)	8-WSON (5x6)	FLASH	105 °C	-40 °C	8-WDFN Exposed Pad	6 ns	Non-Volatile	133 MHz	2 V	1.65 V	16M x 8	60 µs	2.4 ms	QPI Quad I/O SPI	128 Mb	Surface Mount
GigaDevice Semiconductor (HK) Limited GD25LE128EQEGR	FLASH - NOR (SLC)	8-USON (4x4)	FLASH	125 °C	-40 °C	8-XDFN Exposed Pad	6 ns	Non-Volatile	133 MHz	2 V	1.65 V	16M x 8	100 µs	4 ms	QPI Quad I/O SPI	128 Mb	Surface Mount

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Tape & Reel (TR)	2000	$ 1.41
		6000	$ 1.36

Description

General part information

GD25LE128 Series

FLASH - NOR (SLC) Memory IC 128Mbit SPI - Quad I/O, QPI 133 MHz 6 ns 26-WLCSP

Documents

Technical documentation and resources

No documents available