Specification	XS1-G04B-FB144-I4

Connectivity	Configurable
Core Configuration	Quad-Core
Core Processor	XCore
Core Size (Bit Width)	32 Bit
Mounting Type	Surface Mount
Number of I/O	88
Operating Temperature (Max)	85 °C
Operating Temperature (Min)	-40 °C
Oscillator Type	External
Package / Case	144-LFBGA
Package Length	11 mm
Package Name	144-FBGA
Package Width	11 mm
Program Memory Depth	64 K
Program Memory Size	256 KB
Program Memory Type	SRAM
Program Memory Width	32
Speed	400 MIPS
Voltage - Supply (Vcc/Vdd) Maximum	3.6 V
Voltage - Supply (Vcc/Vdd) Minimum	0.95 V

XS1-G04 Series

Part	Speed	Program Memory Depth	Program Memory Width	Program Memory Size	Oscillator Type	Voltage - Supply (Vcc/Vdd) Minimum	Voltage - Supply (Vcc/Vdd) Maximum	Mounting Type	Core Size (Bit Width)	Core Configuration	Core Processor	Program Memory Type	Number of I/O	Package / Case	Operating Temperature (Min)	Operating Temperature (Max)	Package Name	Package Width	Package Length	Connectivity
XMOS XS1-G04B-FB512-C4	400 MIPS	64 K	32	256 KB	External	0.95 V	3.6 V	Surface Mount	32 Bit	Quad-Core	XCore	SRAM	256	512-LFBGA	0 °C	70 °C	512-PBGA	20 mm	20 mm	Configurable
XMOS XS1-G04B-FB144-C4	400 MIPS	64 K	32	256 KB	External	0.95 V	3.6 V	Surface Mount	32 Bit	Quad-Core	XCore	SRAM	88	144-LFBGA	0 °C	70 °C	144-FBGA	11 mm	11 mm	Configurable
XMOS XS1-G04B-FB144-I4	400 MIPS	64 K	32	256 KB	External	0.95 V	3.6 V	Surface Mount	32 Bit	Quad-Core	XCore	SRAM	88	144-LFBGA	-40 °C	85 °C	144-FBGA	11 mm	11 mm	Configurable

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Create a free account to access distributor pricing data.

3D models and CAD resources for this part

Technical documentation and resources