04-1518-11
ActiveAries Electronics
CONN IC DIP SOCKET 4POS GOLD
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04-1518-11
ActiveAries Electronics
CONN IC DIP SOCKET 4POS GOLD
Deep-Dive with AI
DocumentsDatasheet
Technical Specifications
Parameters and characteristics commom to parts in this series
| Specification | 04-1518-11 | 04-1518 Series |
|---|---|---|
| Contact Finish - Mating | Gold | Gold |
| Contact Finish - Post | Gold | Gold, Tin |
| Contact Finish Thickness - Mating | 10 çin | 10 çin |
| Contact Finish Thickness - Mating | 0.25 çm | 0.25 çm |
| Contact Finish Thickness - Post | 10 çin | 10 - 200 çin |
| Contact Finish Thickness - Post | 0.25 çm | 0.25 - 5.08 çm |
| Contact Material - Mating | Beryllium Copper | Beryllium Copper |
| Contact Material - Post [custom] | Brass | Brass |
| Current Rating (Amps) | 3 A | 3 A |
| Features | Open Frame | Open Frame |
| Housing Material | Glass Filled, Polyamide (PA46), Nylon 4/6 | Glass Filled, Polyamide (PA46), Nylon 4/6 |
| Material Flammability Rating | UL94 V-0 | UL94 V-0 |
| Mounting Type | Through Hole | Through Hole |
| Number of Positions or Pins (Grid) [custom] | 4 | 4 |
| Pitch - Mating | 0.1 in | 0.1 in |
| Pitch - Mating | 2.54 mm | 2.54 mm |
| Pitch - Post | 2.54 mm | 2.54 mm |
| Pitch - Post | 0.1 in | 0.1 in |
| Termination | Solder | Solder |
| Termination Post Length | 3.18 mm | 3.18 mm |
| Termination Post Length | 0.125 in | 0.125 in |
| Type | DIP | DIP |
| Type | 5.08 mm | 5.08 mm |
| Type | 0.2 in | 0.2 in |
04-1518 Series
CONN IC DIP SOCKET 4POS GOLD
| Part | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Material - Mating | Mounting Type | Current Rating (Amps) | Housing Material | Number of Positions or Pins (Grid) [custom] | Termination Post Length | Termination Post Length | Contact Finish - Mating | Type | Type | Type | Termination | Pitch - Post | Pitch - Post | Features | Material Flammability Rating | Contact Material - Post [custom] | Contact Finish - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Pitch - Mating | Pitch - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics 04-1518-11H | 10 çin | 0.25 çm | Beryllium Copper | Through Hole | 3 A | Glass Filled, Nylon 4/6, Polyamide (PA46) | 4 | 3.18 mm | 0.125 in | Gold | DIP | 5.08 mm | 0.2 in | Solder | 2.54 mm | 0.1 in | Open Frame | UL94 V-0 | Brass | Gold | 10 çin | 0.25 çm | 0.1 in | 2.54 mm |
Aries Electronics 04-1518-10T | 200 µin | 5.08 µm | Beryllium Copper | Through Hole | 3 A | Glass Filled, Nylon 4/6, Polyamide (PA46) | 4 | 3.18 mm | 0.125 in | Gold | DIP | 5.08 mm | 0.2 in | Solder | 2.54 mm | 0.1 in | Open Frame | UL94 V-0 | Brass | Tin | 10 çin | 0.25 çm | 0.1 in | 2.54 mm |
Aries Electronics 04-1518-10 | 200 µin | 5.08 µm | Beryllium Copper | Through Hole | 3 A | Glass Filled, Nylon 4/6, Polyamide (PA46) | 4 | 3.18 mm | 0.125 in | Gold | DIP | 5.08 mm | 0.2 in | Solder | 2.54 mm | 0.1 in | Open Frame | UL94 V-0 | Brass | Tin | 10 çin | 0.25 çm | 0.1 in | 2.54 mm |
Aries Electronics 04-1518-10H | 200 µin | 5.08 µm | Beryllium Copper | Through Hole | 3 A | Glass Filled, Nylon 4/6, Polyamide (PA46) | 4 | 3.18 mm | 0.125 in | Gold | DIP | 5.08 mm | 0.2 in | Solder | 2.54 mm | 0.1 in | Open Frame | UL94 V-0 | Brass | Tin | 10 çin | 0.25 çm | 0.1 in | 2.54 mm |
Aries Electronics 04-1518-11 | 10 çin | 0.25 çm | Beryllium Copper | Through Hole | 3 A | Glass Filled, Nylon 4/6, Polyamide (PA46) | 4 | 3.18 mm | 0.125 in | Gold | DIP | 5.08 mm | 0.2 in | Solder | 2.54 mm | 0.1 in | Open Frame | UL94 V-0 | Brass | Gold | 10 çin | 0.25 çm | 0.1 in | 2.54 mm |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Bulk | 758 | $ 0.49 | |
Description
General part information
04-1518 Series
4 (2 x 2) Pos DIP, 0.2" (5.08mm) Row Spacing Socket Gold Through Hole
Documents
Technical documentation and resources