Zenode.ai Logo

04-1518-11

Active
Aries Electronics

CONN IC DIP SOCKET 4POS GOLD

Deep-Dive with AI

Search across all available documentation for this part.

DocumentsDatasheet

04-1518-11

Active
Aries Electronics

CONN IC DIP SOCKET 4POS GOLD

Deep-Dive with AI

DocumentsDatasheet

Technical Specifications

Parameters and characteristics commom to parts in this series

Specification04-1518-1104-1518 Series
Contact Finish - MatingGoldGold
Contact Finish - PostGoldGold, Tin
Contact Finish Thickness - Mating10 çin10 çin
Contact Finish Thickness - Mating0.25 çm0.25 çm
Contact Finish Thickness - Post10 çin10 - 200 çin
Contact Finish Thickness - Post0.25 çm0.25 - 5.08 çm
Contact Material - MatingBeryllium CopperBeryllium Copper
Contact Material - Post [custom]BrassBrass
Current Rating (Amps)3 A3 A
FeaturesOpen FrameOpen Frame
Housing MaterialGlass Filled, Polyamide (PA46), Nylon 4/6Glass Filled, Polyamide (PA46), Nylon 4/6
Material Flammability RatingUL94 V-0UL94 V-0
Mounting TypeThrough HoleThrough Hole
Number of Positions or Pins (Grid) [custom]44
Pitch - Mating0.1 in0.1 in
Pitch - Mating2.54 mm2.54 mm
Pitch - Post2.54 mm2.54 mm
Pitch - Post0.1 in0.1 in
TerminationSolderSolder
Termination Post Length3.18 mm3.18 mm
Termination Post Length0.125 in0.125 in
TypeDIPDIP
Type5.08 mm5.08 mm
Type0.2 in0.2 in

04-1518 Series

CONN IC DIP SOCKET 4POS GOLD

PartContact Finish Thickness - PostContact Finish Thickness - PostContact Material - MatingMounting TypeCurrent Rating (Amps)Housing MaterialNumber of Positions or Pins (Grid) [custom]Termination Post LengthTermination Post LengthContact Finish - MatingTypeTypeTypeTerminationPitch - PostPitch - PostFeaturesMaterial Flammability RatingContact Material - Post [custom]Contact Finish - PostContact Finish Thickness - MatingContact Finish Thickness - MatingPitch - MatingPitch - Mating
Aries Electronics
04-1518-11H
10 çin
0.25 çm
Beryllium Copper
Through Hole
3 A
Glass Filled, Nylon 4/6, Polyamide (PA46)
4
3.18 mm
0.125 in
Gold
DIP
5.08 mm
0.2 in
Solder
2.54 mm
0.1 in
Open Frame
UL94 V-0
Brass
Gold
10 çin
0.25 çm
0.1 in
2.54 mm
Aries Electronics
04-1518-10T
200 µin
5.08 µm
Beryllium Copper
Through Hole
3 A
Glass Filled, Nylon 4/6, Polyamide (PA46)
4
3.18 mm
0.125 in
Gold
DIP
5.08 mm
0.2 in
Solder
2.54 mm
0.1 in
Open Frame
UL94 V-0
Brass
Tin
10 çin
0.25 çm
0.1 in
2.54 mm
Aries Electronics
04-1518-10
200 µin
5.08 µm
Beryllium Copper
Through Hole
3 A
Glass Filled, Nylon 4/6, Polyamide (PA46)
4
3.18 mm
0.125 in
Gold
DIP
5.08 mm
0.2 in
Solder
2.54 mm
0.1 in
Open Frame
UL94 V-0
Brass
Tin
10 çin
0.25 çm
0.1 in
2.54 mm
Aries Electronics
04-1518-10H
200 µin
5.08 µm
Beryllium Copper
Through Hole
3 A
Glass Filled, Nylon 4/6, Polyamide (PA46)
4
3.18 mm
0.125 in
Gold
DIP
5.08 mm
0.2 in
Solder
2.54 mm
0.1 in
Open Frame
UL94 V-0
Brass
Tin
10 çin
0.25 çm
0.1 in
2.54 mm
Aries Electronics
04-1518-11
10 çin
0.25 çm
Beryllium Copper
Through Hole
3 A
Glass Filled, Nylon 4/6, Polyamide (PA46)
4
3.18 mm
0.125 in
Gold
DIP
5.08 mm
0.2 in
Solder
2.54 mm
0.1 in
Open Frame
UL94 V-0
Brass
Gold
10 çin
0.25 çm
0.1 in
2.54 mm

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyBulk 758$ 0.49

Description

General part information

04-1518 Series

4 (2 x 2) Pos DIP, 0.2" (5.08mm) Row Spacing Socket Gold Through Hole

Documents

Technical documentation and resources