50-9518-10M

Active

Aries Electronics

CONN IC DIP SOCKET 50POS GOLD

Deep-Dive with AI

Search across all available documentation for this part.

DocumentsDatasheet

50-9518-10M

Active

Aries Electronics

CONN IC DIP SOCKET 50POS GOLD

Deep-Dive with AI

DocumentsDatasheet

Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	50-9518-10M

Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	10 çin
Contact Finish Thickness - Mating	0.25 çm
Contact Finish Thickness - Post	200 µin
Contact Finish Thickness - Post	5.08 µm
Contact Material - Mating	Beryllium Copper
Contact Material - Post [custom]	Brass
Current Rating (Amps)	3 A
Features	Open Frame
Housing Material	Glass Filled, Polyamide (PA46), Nylon 4/6
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid) [custom]	25
Number of Positions or Pins (Grid) [custom]	2
Number of Positions or Pins (Grid) [custom]	50
Pitch - Mating	0.1 in
Pitch - Mating	2.54 mm
Pitch - Post	2.54 mm
Pitch - Post	0.1 in
Termination	Solder
Termination Post Length	3.18 mm
Termination Post Length	0.125 in
Type	22.86 mm
Type	DIP
Type	0.9 in

50-9518 Series

Part	Material Flammability Rating	Type	Type	Type	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Current Rating (Amps)	Contact Material - Mating	Mounting Type	Contact Finish - Post	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Features	Termination	Termination Post Length	Termination Post Length	Pitch - Post	Pitch - Post	Housing Material	Pitch - Mating	Pitch - Mating	Contact Finish - Mating	Contact Material - Post [custom]	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating
Aries Electronics 50-9518-11H	UL94 V-0	22.86 mm	DIP	0.9 in	10 çin	0.25 çm	3 A	Beryllium Copper	Through Hole	Gold	25	2	50	Open Frame	Solder	3.18 mm	0.125 in	2.54 mm	0.1 in	Glass Filled Nylon 4/6 Polyamide (PA46)	0.1 in	2.54 mm	Gold	Brass	10 çin	0.25 çm
Aries Electronics 50-9518-10T	UL94 V-0	22.86 mm	DIP	0.9 in	200 µin	5.08 µm	3 A	Beryllium Copper	Through Hole	Tin	25	2	50	Open Frame	Solder	3.18 mm	0.125 in	2.54 mm	0.1 in	Glass Filled Nylon 4/6 Polyamide (PA46)	0.1 in	2.54 mm	Gold	Brass	10 çin	0.25 çm
Aries Electronics 50-9518-10E	UL94 V-0	22.86 mm	DIP	0.9 in	200 µin	5.08 µm	3 A	Beryllium Copper	Through Hole	Tin	25	2	50	Open Frame	Solder	3.18 mm	0.125 in	2.54 mm	0.1 in	Glass Filled Nylon 4/6 Polyamide (PA46)	0.1 in	2.54 mm	Gold	Brass	10 çin	0.25 çm
Aries Electronics 50-9518-10H	UL94 V-0	22.86 mm	DIP	0.9 in	200 µin	5.08 µm	3 A	Beryllium Copper	Through Hole	Tin	25	2	50	Open Frame	Solder	3.18 mm	0.125 in	2.54 mm	0.1 in	Glass Filled Nylon 4/6 Polyamide (PA46)	0.1 in	2.54 mm	Gold	Brass	10 çin	0.25 çm
Aries Electronics 50-9518-10M	UL94 V-0	22.86 mm	DIP	0.9 in	200 µin	5.08 µm	3 A	Beryllium Copper	Through Hole	Tin	25	2	50	Open Frame	Solder	3.18 mm	0.125 in	2.54 mm	0.1 in	Glass Filled Nylon 4/6 Polyamide (PA46)	0.1 in	2.54 mm	Gold	Brass	10 çin	0.25 çm
Aries Electronics 50-9518-10	UL94 V-0	22.86 mm	DIP	0.9 in	200 µin	5.08 µm	3 A	Beryllium Copper	Through Hole	Tin	25	2	50	Open Frame	Solder	3.18 mm	0.125 in	2.54 mm	0.1 in	Glass Filled Nylon 4/6 Polyamide (PA46)	0.1 in	2.54 mm	Gold	Brass	10 çin	0.25 çm

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	35	$ 13.73

Description

General part information

50-9518 Series

50 (2 x 25) Pos DIP, 0.9" (22.86mm) Row Spacing Socket Gold Through Hole

Documents

Technical documentation and resources