M2S100TS-1FC1152I

Obsolete

Microsemi Corporation

IC SOC CORTEX-M3 166MHZ 1152BGA

Search across all available documentation for this part.

Obsolete

Microsemi Corporation

IC SOC CORTEX-M3 166MHZ 1152BGA

Technical Specifications

Parameters and characteristics for this part

Specification	M2S100TS-1FC1152I

Architecture	MCU, FPGA
Connectivity	CANbus, USB, Ethernet, SPI, UART/USART, I2C
Core Processor	ARM® Cortex®-M3
Flash Size	512 KB
Number of I/O	574
Operating Temperature [Max]	100 °C
Operating Temperature [Min]	-40 C
Package / Case	1152-BBGA, FCBGA
Peripherals	DDR, PCIe, SERDES
Primary Attributes	100K Logic Modules
RAM Size	64 KB
Speed	166 MHz
Supplier Device Package	1152-FCBGA (35x35)

Part	Connectivity	Core Processor	Flash Size	Speed	Operating Temperature [Max]	Operating Temperature [Min]	Number of I/O	RAM Size	Architecture	Package / Case	Supplier Device Package	Primary Attributes	Peripherals
Microsemi Corporation M2S100TS-1FC1152I	CANbus Ethernet I2C SPI UART/USART USB	ARM® Cortex®-M3	512 KB	166 MHz	100 °C	-40 C	574	64 KB	MCU FPGA	1152-BBGA FCBGA	1152-FCBGA (35x35)	100K Logic Modules	DDR PCIe SERDES

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

General part information

ARM® Cortex®-M3 System On Chip (SOC) IC SmartFusion®2 FPGA - 100K Logic Modules 166MHz 1152-FCBGA (35x35)

Technical documentation and resources