SST2907AHZGT116
ActiveRohm Semiconductor
BIPOLAR (BJT) SINGLE TRANSISTOR, PNP, 60 V, 600 MA, 350 MW, SOT-23, SURFACE MOUNT
SST2907AHZGT116
ActiveRohm Semiconductor
BIPOLAR (BJT) SINGLE TRANSISTOR, PNP, 60 V, 600 MA, 350 MW, SOT-23, SURFACE MOUNT
Description
General part information
SST2907AHZG Series
SST2907AHZG is the high reliability Automotive transistor, suitable for audio frequency small signal amplifier.
Technical Specifications
Parameters and characteristics for this part
| Specification | SST2907AHZGT116 |
|---|---|
| Current - Collector (Ic) (Max) | 0.6 mA |
| Current - Collector Cutoff (Max) | 100 nA |
| DC Current Gain (hFE) (Min) | 100 |
| Frequency - Transition | 200 MHz |
| Grade | Automotive |
| Mounting Type | Surface Mount |
| Operating Temperature | 150 °C |
| Package / Case | TO-236-3, SOT-23-3, SC-59 |
| Package Name | SST3 |
| Power - Max | 200 mW |
| Qualification | AEC-Q101 |
| Transistor Type | PNP |
| Vce Saturation (Max) | 1.6 V |
| Voltage - Collector Emitter Breakdown (Max) | 60 V |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Datasheet
Moisture Sensitivity Level - Transistors
How to Use LTspice® Models
Anti-Whisker formation - Transistors
Explanation for Marking
Two-Resistor Model for Thermal Simulation
Part Explanation
What is a Thermal Model? (Transistor)
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
Importance of Probe Calibration When Measuring Power: Deskew
Notes for Temperature Measurement Using Thermocouples
List of Transistor Package Thermal Resistance
ESD Data
Notes for Calculating Power Consumption:Static Operation
Precautions When Measuring the Rear of the Package with a Thermocouple
What Is Thermal Design
Types and Features of Transistors
Temperature derating method for Safe Operating Area (SOA)
PCB Layout Thermal Design Guide
Certificate of not containing SVHC under REACH Regulation
Measurement Method and Usage of Thermal Resistance RthJC
Method for Monitoring Switching Waveform
Taping Information
Reliability Test Result
About Export Regulations
Notes for Temperature Measurement Using Forward Voltage of PN Junction
Impedance Characteristics of Bypass Capacitor
Condition of Soldering / Land Pattern Reference
Package Dimensions
Compliance of the RoHS directive
Calculation of Power Dissipation in Switching Circuit
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
About Flammability of Materials
Basics of Thermal Resistance and Heat Dissipation
How to Use LTspice® Models: Tips for Improving Convergence