ESQT-103-02-F-D-510

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Samtec Inc.

CONN SOCKET 6POS 0.079 GOLD PCB

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ESQT-103-02-F-D-510

Active

Samtec Inc.

CONN SOCKET 6POS 0.079 GOLD PCB

Deep-Dive with AI

Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	ESQT-103-02-F-D-510

Connector Type	Elevated Socket
Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	3 µin
Contact Finish Thickness - Mating	0.076 µm
Contact Length - Post [x]	8.64 mm
Contact Length - Post [x]	0.34 in
Contact Material	Phosphor Bronze
Contact Shape	Square
Contact Type	Forked
Current Rating (Amps)	4.5 A
Fastening Type	Push-Pull
Insulation Color	Black
Insulation Height	0.51 in
Insulation Height	12.95 mm
Insulation Material	Liquid Crystal Polymer (LCP)
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions	6
Number of Positions Loaded	All
Number of Rows	2
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-55 °C
Pitch - Mating [x]	0.079 in
Pitch - Mating [x]	2 mm
Row Spacing - Mating	0.079 in
Row Spacing - Mating	2 mm
Style	Board to Board, Cable
Termination	Solder

ESQT-103 Series

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Part	Mounting Type	Insulation Height	Insulation Height	Material Flammability Rating	Contact Finish - Mating	Current Rating (Amps)	Connector Type	Insulation Material	Operating Temperature [Min]	Operating Temperature [Max]	Termination	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Pitch - Mating [x]	Pitch - Mating [x]	Number of Rows	Contact Finish - Post	Contact Shape	Insulation Color	Fastening Type	Number of Positions Loaded	Contact Type	Style	Contact Length - Post	Contact Length - Post	Contact Material	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Row Spacing - Mating	Row Spacing - Mating	Number of Positions	Contact Length - Post [x]	Contact Length - Post [x]	Insulation Height [custom]	Insulation Height [custom]
Samtec Inc. ESQT-103-02-F-S-309	Through Hole	0.309 in	7.85 mm	UL94 V-0	Gold	4.5 A	Elevated Socket	Liquid Crystal Polymer (LCP)	-55 °C	125 °C	Solder	3 µin	0.076 µm	0.079 in	2 mm	1	Tin	Square	Black	Push-Pull	All	Forked	Board to Board Cable	0.541 in	13.74 mm	Phosphor Bronze
Samtec Inc. ESQT-103-03-G-D-310	Through Hole	0.31 in	7.87 mm	UL94 V-0	Gold	4.5 A	Elevated Socket	Liquid Crystal Polymer (LCP)	-55 °C	125 °C	Solder	20 µin	0.51 µm	0.079 in	2 mm	2	Gold	Square	Black	Push-Pull	All	Forked	Board to Board Cable	0.148 in	3.76 mm	Phosphor Bronze	3 µin	0.076 µm	0.079 in	2 mm	6
Samtec Inc. ESQT-103-02-F-D-510	Through Hole	0.51 in	12.95 mm	UL94 V-0	Gold	4.5 A	Elevated Socket	Liquid Crystal Polymer (LCP)	-55 °C	125 °C	Solder	3 µin	0.076 µm	0.079 in	2 mm	2	Tin	Square	Black	Push-Pull	All	Forked	Board to Board Cable			Phosphor Bronze			0.079 in	2 mm	6	8.64 mm	0.34 in
Samtec Inc. ESQT-103-02-H-D-420	Through Hole			UL94 V-0	Gold	4.5 A	Elevated Socket	Liquid Crystal Polymer (LCP)	-55 °C	125 °C	Solder	30 Áin	0.76 Ám	0.079 in	2 mm	2	Gold	Square	Black	Push-Pull	All	Forked	Board to Board Cable	0.43 in	10.92 mm	Phosphor Bronze	3 µin	0.076 µm	0.079 in	2 mm	6			0.42 in	10.67 mm
Samtec Inc. ESQT-103-02-G-D-461	Through Hole	0.461 "	11.7 mm	UL94 V-0	Gold	4.5 A	Elevated Socket	Liquid Crystal Polymer (LCP)	-55 °C	125 °C	Solder	20 µin	0.51 µm	0.079 in	2 mm	2	Gold	Square	Black	Push-Pull	All	Forked	Board to Board Cable			Phosphor Bronze	3 µin	0.076 µm	0.079 in	2 mm	6	9.88 mm	0.389 in
Samtec Inc. ESQT-103-02-F-D-800	Through Hole	0.8 in	20.32 mm	UL94 V-0	Gold	4.5 A	Elevated Socket	Liquid Crystal Polymer (LCP)	-55 °C	125 °C	Solder	3 µin	0.076 µm	0.079 in	2 mm	2	Tin	Square	Black	Push-Pull	All	Forked	Board to Board Cable	0.05 in	1.27 mm	Phosphor Bronze			0.079 in	2 mm	6
Samtec Inc. ESQT-103-03-L-D-370	Through Hole	0.37 in	9.4 mm	UL94 V-0	Gold	4.5 A	Elevated Socket	Liquid Crystal Polymer (LCP)	-55 °C	125 °C	Solder	10 çin	0.25 çm	0.079 in	2 mm	2	Tin	Square	Black	Push-Pull	All	Forked	Board to Board Cable			Phosphor Bronze			0.079 in	2 mm	6	2.23 mm	0.088 in
Samtec Inc. ESQT-103-03-G-D-350	Through Hole			UL94 V-0	Gold	4.5 A	Elevated Socket	Liquid Crystal Polymer (LCP)	-55 °C	125 °C	Solder	20 µin	0.51 µm	0.079 in	2 mm	2	Gold	Square	Black	Push-Pull	All	Forked	Board to Board Cable	0.108 in	2.75 mm	Phosphor Bronze	3 µin	0.076 µm	0.079 in	2 mm	6			0.35 in	8.89 mm
Samtec Inc. ESQT-103-02-L-D-410	Through Hole			UL94 V-0	Gold	4.5 A	Elevated Socket	Liquid Crystal Polymer (LCP)	-55 °C	125 °C	Solder	10 çin	0.25 çm	0.079 in	2 mm	2	Tin	Square	Black	Push-Pull	All	Forked	Board to Board Cable	0.44 in	11.18 mm	Phosphor Bronze			0.079 in	2 mm	6
Samtec Inc. ESQT-103-02-G-S-408	Through Hole	0.408 in	10.36 mm	UL94 V-0	Gold	4.5 A	Elevated Socket	Liquid Crystal Polymer (LCP)	-55 °C	125 °C	Solder	20 µin	0.51 µm	0.079 in	2 mm	1	Gold	Square	Black	Push-Pull	All	Forked	Board to Board Cable	0.442 in	11.23 mm	Phosphor Bronze	3 µin	0.076 µm

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	1	$ 3.11

Description

General part information

ESQT-103 Series

6 Position Elevated Socket Connector 0.079" (2.00mm) Through Hole Gold

Documents

Technical documentation and resources

No documents available