UPD70F3551M1GJA-GBG-QS-AX

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Renesas Electronics Corporation

IC MCU 32B 512KB FLASH 144HLFQFP

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Renesas Electronics Corporation

IC MCU 32B 512KB FLASH 144HLFQFP

Technical Specifications

Parameters and characteristics for this part

Specification	UPD70F3551M1GJA-GBG-QS-AX

Connectivity	LINbus, CANbus, UART/USART, CSI, I2C
Core Processor	V850E2
Core Size	32-Bit Single-Core
Data Converters [custom]	12
Data Converters [custom]	24
EEPROM Size	32 K
Mounting Type	Surface Mount
Number of I/O	112
Operating Temperature [Max]	85 °C
Operating Temperature [Min]	-40 °C
Oscillator Type	Internal
Package / Case	144-LQFP Exposed Pad
Peripherals	WDT, PWM, DMA
Program Memory Size	512 KB
Program Memory Type	FLASH
Speed	80 MHz
Supplier Device Package	144-HLFQFP (20x20)
Voltage - Supply (Vcc/Vdd) [Max]	5.5 V
Voltage - Supply (Vcc/Vdd) [Min]	3 V

IC MCU 32B 512KB FLASH 144HLFQFP

Part	Peripherals	Connectivity	Package / Case	Voltage - Supply (Vcc/Vdd) [Max]	Voltage - Supply (Vcc/Vdd) [Min]	Operating Temperature [Max]	Operating Temperature [Min]	Mounting Type	Core Processor	Supplier Device Package	Oscillator Type	Program Memory Type	EEPROM Size	Core Size	Number of I/O	Program Memory Size	Data Converters [custom]	Data Converters [custom]	Speed
Renesas Electronics Corporation UPD70F3551M1GJA-GBG-QS-AX	DMA, PWM, WDT	CANbus, CSI, I2C, LINbus, UART/USART	144-LQFP Exposed Pad	5.5 V	3 V	85 °C	-40 °C	Surface Mount	V850E2	144-HLFQFP (20x20)	Internal	FLASH	32 K	32-Bit Single-Core	112	512 KB	12	24	80 MHz

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

General part information

V850E2 V850E2/Fx4 Microcontroller IC 32-Bit Single-Core 80MHz 512KB (512K x 8) FLASH 144-HLFQFP (20x20)

Technical documentation and resources

No documents available