RFVS8TG6SGC9
ActiveRohm Semiconductor
DIODE STANDARD 600V 8A TO220ACFP
RFVS8TG6SGC9
ActiveRohm Semiconductor
DIODE STANDARD 600V 8A TO220ACFP
Description
General part information
RFVS8TG6S Series
RFVS8TG6S is the silicon epitaxial planar type Fast Recovery Diode for PFC.
Technical Specifications
Parameters and characteristics for this part
| Specification | RFVS8TG6SGC9 |
|---|---|
| Current - Average Rectified (Io) | 8 A |
| Current - Reverse Leakage | 10 µA |
| Mounting Type | Through Hole |
| Operating Temperature - Junction (Max) | 150 °C |
| Package / Case | TO-220-2 |
| Package Name | TO-220ACFP |
| Reverse Recovery Time (trr) | 40 ns |
| Speed - Fast Recovery (Maximum) | 500 ns |
| Speed - Fast Recovery (Minimum) | 200 mA |
| Technology | Standard |
| Voltage - DC Reverse (Vr) (Max) | 600 V |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Datasheet
How to Use LTspice® Models
Inner Structure
Reliability Test Result
How to Create Symbols for PSpice Models
ESD Data
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
Impedance Characteristics of Bypass Capacitor
Taping Information
About Flammability of Materials
Notes for Calculating Power Consumption:Static Operation
Method for Monitoring Switching Waveform
Importance of Probe Calibration When Measuring Power: Deskew
About Export Regulations
Notes for Temperature Measurement Using Forward Voltage of PN Junction
What is a Thermal Model? (Diode)
How to Select Reverse Current Protection Diodes for LDO Regulators
How to Use LTspice® Models: Tips for Improving Convergence
θ<sub>JC</sub> and Ψ<sub>JT</sub>
How to Use the Thermal Resistance and Thermal Characteristics Parameters
Certificate of not containing SVHC under REACH Regulation
Package Dimensions
θ<sub>JA</sub> and Ψ<sub>JT</sub>
Two-Resistor Model for Thermal Simulation
Diode Types and Applications
Moisture Sensitivity Level - Diodes
Judgment Criteria of Thermal Evaluation
Compliance of the RoHS directive
PCB Layout Thermal Design Guide
Explanation for Marking
Anti-Whisker formation - Diodes
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
Absolute Maximum Rating and Electrical Characteristics of Diodes
How to Select Rectifier Diodes
Power Loss and Thermal Design of Diodes
Measurement Method and Usage of Thermal Resistance RthJC
Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials
Part Explanation
Precautions When Measuring the Rear of the Package with a Thermocouple
Basics of Thermal Resistance and Heat Dissipation
Notes for Temperature Measurement Using Thermocouples
List of Diode Package Thermal Resistance
What Is Thermal Design
Condition of Soldering / Land Pattern Reference