MXLUPTB33E3
Active5V – 48V POWERMITE1, SURFACE MOUNT TRANSIENT VOLTAGE SUPPRESSORS
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MXLUPTB33E3
Active5V – 48V POWERMITE1, SURFACE MOUNT TRANSIENT VOLTAGE SUPPRESSORS
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Technical Specifications
Parameters and characteristics commom to parts in this series
| Specification | MXLUPTB33E3 | UPTB33 Series |
|---|---|---|
| - | - | |
| Applications | General Purpose | General Purpose |
| Bidirectional Channels [custom] | 1 | 1 |
| Current - Peak Pulse (10/1000µs) | 2.65 A | 2.65 A |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature [Max] | 150 °C | 150 °C |
| Operating Temperature [Min] | -65 °C | -65 °C |
| Package / Case | DO-216AA | DO-216AA |
| Power - Peak Pulse | 1000 W | 1000 W |
| Power - Peak Pulse | 1 kW | 1 kW |
| Power Line Protection | False | False |
| Supplier Device Package | Powermite 1 (DO216-AA) | Powermite 1 (DO216-AA) |
| Type | Zener | Zener |
| Voltage - Breakdown (Min) [Min] | 36.8 V | 36.8 V |
| Voltage - Reverse Standoff (Typ) | 33 V | 33 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Bulk | 100 | $ 10.76 | |
| Microchip Direct | N/A | 1 | $ 11.59 | |
| 100 | $ 10.76 | |||
| 500 | $ 10.36 | |||
| 1000 | $ 9.77 | |||
| Newark | Each | 100 | $ 10.76 | |
| 500 | $ 10.36 | |||
UPTB33 Series
5V – 48V Powermite1, Surface Mount Transient Voltage Suppressors
| Part | Supplier Device Package | Operating Temperature [Max] | Operating Temperature [Min] | Voltage - Breakdown (Min) [Min] | Power - Peak Pulse | Power - Peak Pulse | Bidirectional Channels [custom] | Applications | Mounting Type | Current - Peak Pulse (10/1000µs) | Type | Package / Case | Voltage - Reverse Standoff (Typ) | Power Line Protection |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology MXLUPTB33 | ||||||||||||||
Microchip Technology UPTB33/TR13 | Powermite 1 (DO216-AA) | 150 °C | -65 °C | 36.8 V | 1000 W | 1 kW | 1 | General Purpose | Surface Mount | 2.65 A | Zener | DO-216AA | 33 V | |
Microchip Technology UPTB33/TR7 | ||||||||||||||
Microchip Technology UPTB33/TR7 | Powermite 1 (DO216-AA) | 150 °C | -65 °C | 36.8 V | 1000 W | 1 kW | 1 | General Purpose | Surface Mount | 2.65 A | Zener | DO-216AA | 33 V | |
Microchip Technology MXLUPTB33E3 | ||||||||||||||
Microchip Technology UPTB33E3/TR13 | Powermite 1 (DO216-AA) | 150 °C | -65 °C | 36.8 V | 1000 W | 1 kW | 1 | General Purpose | Surface Mount | 2.65 A | Zener | DO-216AA | 33 V | |
Microchip Technology MXUPTB33E3 | Powermite 1 (DO216-AA) | 150 °C | -65 °C | 36.8 V | 1000 W | 1 kW | 1 | General Purpose | Surface Mount | 2.65 A | Zener | DO-216AA | 33 V | |
Microchip Technology UPTB33E3/TR7 | Powermite 1 (DO216-AA) | 150 °C | -65 °C | 36.8 V | 1000 W | 1 kW | 1 | General Purpose | Surface Mount | 2.65 A | Zener | DO-216AA | 33 V | |
Microchip Technology MXLUPTB33 | Powermite 1 (DO216-AA) | 150 °C | -65 °C | 36.8 V | 1000 W | 1 kW | 1 | General Purpose | Surface Mount | 2.65 A | Zener | DO-216AA | 33 V | |
Microchip Technology UPTB33E3/TR7 | ||||||||||||||
Microchip Technology UPTB33E3/TR13 | ||||||||||||||
Microchip Technology MXLUPTB33E3 | Powermite 1 (DO216-AA) | 150 °C | -65 °C | 36.8 V | 1000 W | 1 kW | 1 | General Purpose | Surface Mount | 2.65 A | Zener | DO-216AA | 33 V | |
Microchip Technology MXUPTB33 | ||||||||||||||
Microchip Technology MXUPTB33 | Powermite 1 (DO216-AA) | 150 °C | -65 °C | 36.8 V | 1000 W | 1 kW | 1 | General Purpose | Surface Mount | 2.65 A | Zener | DO-216AA | 33 V | |
Microchip Technology MXUPTB33E3 |
Description
General part information
UPTB33 Series
Microchip’s unique and new Powermite MUPT series of transient voltage suppressors feature oxide-passivated chips with high-temperature solder bonds for high surge capability and negligible electrical degradation under repeated surge conditions. Both unidirectional and bidirectional configurations are available. In addition to its size advantages, the Powermite package includes a fully metallic bottom (anode) side that eliminates the possibility of solder flux entrapment at assembly and a unique locking tab design serves as an integral heat sink. Its innovative design makes this device fully compatible for use with automatic insertion equipment
Documents
Technical documentation and resources