Specification	LAXP2-17E-5QN208E

Mounting Type	Surface Mount
Number of I/O	146
Number of LABs/CLBs	2125
Number of Logic Elements/Cells	17000
Operating Temperature (Max)	125 °C
Operating Temperature (Min)	-40 °C
Package / Case	208-BFQFP
Package Length	28 mm
Package Name	208-PQFP
Package Width	28 mm
Total RAM Bits	282624 bits
Voltage - Supply (Maximum)	1.26 V
Voltage - Supply (Minimum)	1.14 V

LAXP2 Series

Part	Package / Case	Total RAM Bits	Mounting Type	Number of I/O	Voltage - Supply (Minimum)	Voltage - Supply (Maximum)	Number of LABs/CLBs	Package Length	Package Name	Package Width	Operating Temperature (Max)	Operating Temperature (Min)	Number of Logic Elements/Cells
Lattice Semiconductor Corporation LAXP2-17E-5FTN256E	256-LBGA	282624 bits	Surface Mount	201	1.14 V	1.26 V	2125	17 mm	256-FTBGA	17 mm	125 °C	-40 °C	17000
Lattice Semiconductor Corporation LAXP2-5E-5TN144E	144-LQFP	169984 bits	Surface Mount	100	1.14 V	1.26 V	625	20 mm	144-TQFP	20 mm	125 °C	-40 °C	5000
Lattice Semiconductor Corporation LAXP2-5E-5MN132E	132-LFBGA CSPBGA	169984 bits	Surface Mount	86	1.14 V	1.26 V	625	8 mm	132-CSBGA	8 mm	125 °C	-40 °C	5000
Lattice Semiconductor Corporation LAXP2-17E-5QN208E	208-BFQFP	282624 bits	Surface Mount	146	1.14 V	1.26 V	2125	28 mm	208-PQFP	28 mm	125 °C	-40 °C	17000
Lattice Semiconductor Corporation LAXP2-8E-5TN144E	144-LQFP	226304 bits	Surface Mount	100	1.14 V	1.26 V	1000	20 mm	144-TQFP	20 mm	125 °C	-40 °C	8000
Lattice Semiconductor Corporation LAXP2-5E-5FTN256E	256-LBGA	169984 bits	Surface Mount	172	1.14 V	1.26 V	625	17 mm	256-FTBGA	17 mm	125 °C	-40 °C	5000
Lattice Semiconductor Corporation LAXP2-8E-5MN132E	132-LFBGA CSPBGA	226304 bits	Surface Mount	86	1.14 V	1.26 V	1000	8 mm	132-CSBGA	8 mm	125 °C	-40 °C	8000

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