PMEG030V030EPDZ
ActiveNexperia USA Inc.
30 V, 3 A LOW VF MEGA SCHOTTKY BARRIER RECTIFIER
PMEG030V030EPDZ
ActiveNexperia USA Inc.
30 V, 3 A LOW VF MEGA SCHOTTKY BARRIER RECTIFIER
Description
General part information
PMEG030V030EPD Series
30 V, 3 A low VF MEGA Schottky barrier rectifier
Technical Specifications
Parameters and characteristics for this part
| Specification | PMEG030V030EPDZ |
|---|---|
| Capacitance | 495 pF |
| Current - Average Rectified (Io) | 3 A |
| Current - Reverse Leakage | 150 µA |
| Grade | Automotive |
| Mounting Type | Surface Mount |
| Operating Temperature - Junction (Max) | 175 °C |
| Package / Case | TO-277, 3-PowerDFN |
| Package Name | CFP15 |
| Qualification | AEC-Q101 |
| Reverse Recovery Time (trr) | 12 ns |
| Speed - Fast Recovery (Maximum) | 500 ns |
| Speed - Fast Recovery (Minimum) | 200 mA |
| Technology | Schottky |
| Voltage - DC Reverse (Vr) (Max) | 30 V |
| Voltage - Forward (Vf) (Max) | 450 mV |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
Sign in to see pricing
Create a free account to access distributor pricing data.
CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Datasheet
CFP15; Reel pack for SMD, 7"; Q4/T2 product orientation
Wave soldering guidelines for flatpack packages
Schottky rectifiers in CFP packages
plastic, thermal enhanced ultra thin SMD package; 3 terminals; 2.13 mm pitch; 5.8 x 4.3 x 0.78 mm body
Evaluation of junction temperature and thermal stacks using the virtual junction
Reflow soldering profile
CFP封装的肖特基整流器
Wave soldering profile
Questions about package outline drawings
PMEG030V030EPD Nexperia Product Reliability
plastic, thermal enhanced ultra thin SMD package; 3 terminals; 5.8 x 4.3 x 0.78 mm body
Nexperia package poster