The HybridPACKTMpower module is built on Infineon’s long time experience in the development of IGBT power modules, intense research efforts of new material combinations and assembly technologies. HybridPACKTMis suitable for air or liquid cooling. The copper base plate combined with high-performance ceramic substrate and Infineon’s enhanced wire-bonding process provides unparalleled thermal and power cycling capability and highest reliability for mild hybrid inverter or generator applications. For a compact design the driver stage PCB can easily be soldered on top of the module. All power connections are realized with screw terminals.