Beta

⌘K

907-33-1-12-2-B-0

907-33-1-12-2-B-0

Active

Wakefield Thermal Solutions

HEAT SINKS CHIPSET HEAT SINK WITH CLIP, ELLIPTICAL, 33MM CHIP SIZE, 11.6MM HEIGHT, ALUMINUM

907-33-1-12-2-B-0

907-33-1-12-2-B-0

Active

Wakefield Thermal Solutions

HEAT SINKS CHIPSET HEAT SINK WITH CLIP, ELLIPTICAL, 33MM CHIP SIZE, 11.6MM HEIGHT, ALUMINUM

Description Specifications Series Pricing CAD Documents

Description

General part information

907 Series

Heat Sinks Chipset Heat Sink with Clip, Elliptical, 33mm Chip Size, 11.6mm Height, Aluminum

Technical Specifications

Parameters and characteristics for this part

Specification	907-33-1-12-2-B-0

Attachment Method	Push Pin
Fin Height	0.457 in
Length	1.299 "
Material	Aluminum
Material Finish	Black Anodized
Package Cooled	BGA
Shape	Square, Pin Fins
Thermal Resistance	11.6 °C/W, 3.23 °C/W
Type	Top Mount
Width	1.299 in

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Sign in to see pricing

Create a free account to access distributor pricing data.

Sign up — free Log in

CAD

3D models and CAD resources for this part

Documents

Technical documentation and resources

907-33-1-12-2-B-0 | Datasheet

907 Series

Heat Sinks Chipset Heat Sink with Clip, Elliptical, 33mm Chip Size, 11.6mm Height, Aluminum

Part	Length	Thermal Resistance	Shape	Width	Material	Package Cooled	Type	Attachment Method	Material Finish	Fin Height
Wakefield Thermal Solutions 907-33-1-12-2-B-0	1.299 "	3.23 °C/W 11.6 °C/W	Pin Fins Square	1.299 in	Aluminum	BGA	Top Mount	Push Pin	Black Anodized	0.457 in