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Description

General part information

OSP/BMA Miniature Modular Series

OSP/BMA Connector, Jack, 50 ohm, Push-On, 18 GHz, 1 Position, Printed Circuit Board, -65 – 165 °C [-85 – 329 °F], OSP/BMA Miniature Modular

Technical Specifications

Parameters and characteristics for this part

Specification1059681-1
Body FinishGold
Body MaterialStainless Steel
Center Contact MaterialBeryllium Copper
Center Contact PlatingGold
Connector StyleMini, OSP
Connector TypeJack, Female Socket
Contact TerminationSolder
Dielectric MaterialPolytetrafluoroethylene (PTFE)
Fastening TypeSnap-On
Frequency - Max18 GHz
Housing ColorGold
Impedance50 Ohm
Mating Cycles5000 cycles
Mounting TypeThrough Hole
Number of Ports1
Operating Temperature (Max)165 °C
Operating Temperature (Min)-65 °C
Shield TerminationSolder
Voltage Rating335 V

Pricing

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CAD

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