Specification	XC7S75-1FGGA676I

Mounting Type	Surface Mount
Number of I/O	400
Number of LABs/CLBs	6000
Number of Logic Elements/Cells	76800
Operating Temperature (Max)	100 °C
Operating Temperature (Min)	-40 °C
Package / Case	676-BGA
Package Length	27 mm
Package Name	676-FPBGA
Package Width	27 mm
Total RAM Bits	4331520 bits
Voltage - Supply (Maximum)	1.05 V
Voltage - Supply (Minimum)	0.95 V

XC7S75 Series

Part	Number of Logic Elements/Cells	Total RAM Bits	Operating Temperature (Max)	Operating Temperature (Min)	Voltage - Supply (Minimum)	Voltage - Supply (Maximum)	Package / Case	Number of LABs/CLBs	Mounting Type	Package Width	Package Name	Package Length	Number of I/O
AMD / Xilinx XC7S75-2FGGA484C	76800	4331520 bits	85 °C	0 °C	0.95 V	1.05 V	484-BGA	6000	Surface Mount	23 mm	484-FPBGA	23 mm	338
AMD / Xilinx XC7S75-1FGGA676I	76800	4331520 bits	100 °C	-40 °C	0.95 V	1.05 V	676-BGA	6000	Surface Mount	27 mm	676-FPBGA	27 mm	400
AMD / Xilinx XC7S75-L1FGGA676I	76800	4331520 bits	100 °C	-40 °C	0.92 V	0.98 V	676-BGA	6000	Surface Mount	27 mm	676-FPBGA	27 mm	400
AMD / Xilinx XC7S75-2FGGA484I	76800	4331520 bits	100 °C	-40 °C	0.95 V	1.05 V	484-BGA	6000	Surface Mount	23 mm	484-FPBGA	23 mm	338
AMD / Xilinx XC7S75-1FGGA484C	76800	4331520 bits	85 °C	0 °C	0.95 V	1.05 V	484-BGA	6000	Surface Mount	23 mm	484-FPBGA	23 mm	338

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Create a free account to access distributor pricing data.

3D models and CAD resources for this part

Technical documentation and resources