
BUK7D36-60EX
ActiveNexperia USA Inc.
POWER MOSFET, N CHANNEL, 60 V, 14 A, 0.028 OHM, DFN2020MD, SURFACE MOUNT

BUK7D36-60EX
ActiveNexperia USA Inc.
POWER MOSFET, N CHANNEL, 60 V, 14 A, 0.028 OHM, DFN2020MD, SURFACE MOUNT
Description
General part information
BUK7D36-60E Series
N-channel enhancement mode Field-Effect Transistor (FET) in a medium power DFN2020MD-6 (SOT1220) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology.
Technical Specifications
Parameters and characteristics for this part
| Specification | BUK7D36-60EX |
|---|---|
| Current - Continuous Drain (Id) (Ta) | 5.5 A |
| Current - Continuous Drain (Id) (Tc) | 14 A |
| Drain to Source Voltage (Vdss) | 60 V |
| Drive Voltage (Max Rds On, Min Rds On) | 10 V |
| FET Type | N-Channel |
| Gate Charge (Max) | 14 nC |
| Grade | Automotive |
| Input Capacitance (Ciss) (Max) | 453 pF |
| Mounting Type | Surface Mount |
| Operating Temperature (Max) | 175 °C |
| Operating Temperature (Min) | -55 °C |
| Package / Case | 6-UDFN Exposed Pad |
| Package Name | DFN2020MD-6 |
| Power Dissipation (Max) | 2.3 W, 15 W |
| Qualification | AEC-Q101 |
| Rds On (Max) | 36 mOhm |
| Technology | MOSFET (Metal Oxide) |
| Vgs (Max) | 20 V |
| Vgs(th) (Max) | 4 V |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Datasheet
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Nexperia package poster
Thermal performance of DFN packages
plastic, leadless thermal enhanced ultra thin small outline package with side-wettable flanks (SWF); 6 terminals; 0.65 mm pitch; 2 mm x 2 mm x 0.65 mm body
Reflow soldering profile
Automatic Optical Inspection of DFN Components
plastic, thermal enhanced ultra thin small outline package; no leads; 6 terminals; 0.65 mm pitch; 2 mm x 2 mm x 0.65 mm body
DFN2020MD-6; Reel pack for SMD, 7''; Q2/T3 product orientation
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Questions about package outline drawings