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Description

General part information

CC2564 Series

The CC2564C device from Texas Instruments™ is a completeBluetooth®BR/EDR, and low energy HCI level solution, providing high performance and robust Bluetooth solution. Based on TI’s seventh-generation Bluetooth core, the CC2564C device provides a product-proven solution that is Bluetooth 5.1-compliant, adding LE security and enhancing support for complex topologies (dual mode and link layer topologies). This HCI device offers best-in-class RF performance with about twice the throughput of other Bluetooth low-energy solutions, and includes a royalty-free software stack compatible with several host MCUs and MPUs, for a complete Bluetooth solution. Furthermore, TI’s power-management hardware and software algorithms provide significant power savings in all commonly used Bluetooth BR, EDR, and low energy modes of operation.

The TI dual-mode Bluetooth stack software is certified and provided royalty free for MCUs and MPUs. The iPod®(MFi) protocol is supported by add-on software packages. For more information, seeTI Dual-Mode Bluetooth Stack. Multiple profiles and sample applications, including the following, are supported:

Serial port profile (SPP)

Technical Specifications

Parameters and characteristics for this part

SpecificationCC2564YFVR
Current - Receiving (Max)41.2 mA
Current - Receiving (Min)40.5 mA
Current - Transmitting (Max)41.2 mA
Current - Transmitting (Min)40.5 mA
Data Rate (Max)4 MBaud
Frequency2.4 GHz
ModulationGMSK, GFSK
Mounting TypeSurface Mount
Operating Temperature (Max)85 °C
Operating Temperature (Min)-40 °C
Package / CaseDSBGA, 54-UFBGA
Package Length2.93 mm
Package Name54-DSBGA
Package Width3.27 mm
Power - Output12 dBm
ProtocolBluetooth v4.0
RF Family/StandardBluetooth
Sensitivity-95 dBm
Serial InterfacesUART, I2S
TypeTxRx Only
Voltage - Supply (Maximum)4.8 V
Voltage - Supply (Minimum)2.2 V

Pricing

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CAD

3D models and CAD resources for this part

Documents

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