BAS16DY-QX
ActiveNexperia USA Inc.
DIODE ARRAY GP 100V 110MA 6TSSOP
BAS16DY-QX
ActiveNexperia USA Inc.
DIODE ARRAY GP 100V 110MA 6TSSOP
Description
General part information
BAS16DY-Q Series
High-speed switching, electrically isolated dual diode, encapsulated in an ultra small SOT363 Surface-Mounted Device (SMD) plastic package.
Technical Specifications
Parameters and characteristics for this part
| Specification | BAS16DY-QX |
|---|---|
| Current - Average Rectified (Io) (per Diode) | 110 mA |
| Current - Reverse Leakage | 500 nA |
| Diode Configuration | Independent |
| Diode Count | 2 |
| Grade | Automotive |
| Mounting Type | Surface Mount |
| Operating Temperature - Junction | 150 °C |
| Package / Case | 6-TSSOP, SC-88, SOT-363 |
| Package Name | 6-TSSOP |
| Qualification | AEC-Q101 |
| Reverse Recovery Time (trr) | 4 ns |
| Speed | Any Speed, Small Signal |
| Speed - Fast Recovery (Maximum) | 200 mA |
| Speed - Small Signal Current Max | 200 mA, 200 mA, 200 mA |
| Technology | Standard |
| Voltage - DC Reverse (Vr) (Max) | 100 V |
| Voltage - Forward (Vf) (Max) | 1 V |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Datasheet
Questions about package outline drawings
TSSOP6; Reel pack for SMD, 7"; Q2/T3 product orientation
MAR_SOT363 Topmark
Wave soldering profile
PicoGate leaded logic portfolio guide
plastic, surface-mounted package; 6 leads; 0.65 mm pitch; 2.1 mm x 1.25 mm x 0.95 mm body
BAS16DY-Q Nexperia Product Reliability
plastic, surface-mounted package; 6 leads; 1.3 mm pitch; 2 mm x 1.25 mm x 0.95 mm body
Reflow soldering profile
Low temperature soldering, application study
Nexperia package poster