74LVCU04APW-Q100J

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Nexperia USA Inc.

IC INVERTER 6CH 1-INP 14TSSOP

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74LVCU04APW-Q100J

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Nexperia USA Inc.

IC INVERTER 6CH 1-INP 14TSSOP

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Description Specifications Series Pricing CAD Documents

Description

General part information

74LVCU04APW-Q100 Series

The 74LVCU04A-Q100 is a hex unbuffered inverter. Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of these devices as translators in mixed 3.3 V and 5 V environments.

Technical Specifications

Parameters and characteristics for this part

Specification	74LVCU04APW-Q100J

Current - Output High	24 mA
Current - Output Low	24 mA
Current - Quiescent (Max)	40 ĄA
Grade	Automotive
Input Logic Level - High (Max)	2.2 V
Input Logic Level - High (Min)	1.2 V
Input Logic Level - Low (Max)	0.55 V
Input Logic Level - Low (Min)	0.2 V
Logic Type	Inverter
Max CL	50 pF
Max Propagation Delay	4 ns
Mounting Type	Surface Mount
Number of Circuits	6
Number of Inputs	1
Operating Temperature (Max)	125 °C
Operating Temperature (Min)	-40 °C
Package Length	0.173 in
Package Name	14-TSSOP
Package Width	4.4 mm
Qualification	AEC-Q100
Voltage - Supply (Maximum)	3.6 V
Voltage - Supply (Minimum)	1.2 V

74LVCU04APW-Q100 Series

Hex unbuffered inverter

Part	Number of Circuits	Grade	Package Width	Package Name	Package Length	Voltage - Supply (Minimum)	Voltage - Supply (Maximum)	Qualification	Input Logic Level - Low (Min)	Input Logic Level - Low (Max)	Input Logic Level - High (Max)	Input Logic Level - High (Min)	Max CL	Max Propagation Delay	Current - Output Low	Current - Output High	Logic Type	Mounting Type	Current - Quiescent (Max)	Operating Temperature (Max)	Operating Temperature (Min)	Number of Inputs
Nexperia USA Inc. 74LVCU04APW-Q100J	6	Automotive	4.4 mm	14-TSSOP	0.173 in	1.2 V	3.6 V	AEC-Q100	0.2 V	0.55 V	2.2 V	1.2 V	50 pF	4 ns	24 mA	24 mA	Inverter	Surface Mount	40 ĄA	125 °C	-40 °C	1

Pricing

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CAD

3D models and CAD resources for this part

Documents

Technical documentation and resources

Datasheet

Nexperia package poster

plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.2 mm body

Power considerations when using CMOS and BiCMOS logic devices

Footprint for wave soldering

TSSOP14; Reel pack for SMD, 13"; Q1/T1 product orientation

plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body

Pin FMEA for LVC family

74LVCU04APW-Q100 Nexperia Product Reliability