
DSA557-03 Series
Manufacturer: Microchip Technology
DUAL-OUTPUT PCIE CLOCK GEN FOR AUTOMOTIVE
| Part | Package / Case | Operating Temperature (Max) | Operating Temperature (Min) | Output | Voltage - Supply (Minimum) | Voltage - Supply (Maximum) | Differential Output | Differential Input | PLL | Frequency - Max | Package Width | Package Length | Package Name | Input Ratio | Output Ratio | Main Purpose | Number of Circuits | Mounting Type | Grade | Qualification |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology | 14-VFQFN Exposed Pad | 105 °C | -40 °C | HCSL LVCMOS LVDS | 2.25 V | 3.63 V | Yes | No | Yes | 100 MHz | 3.2 mm | 2.5 mm | 14-QFN | 1 | 2 | PCI Express (PCIe) | 1 | Surface Mount | ||
Microchip Technology | 14-VFQFN Exposed Pad | 85 °C | -40 °C | HCSL LVCMOS LVDS | 2.25 V | 3.63 V | Yes | No | Yes | 100 MHz | 3.2 mm | 2.5 mm | 14-QFN | 1 | 2 | PCI Express (PCIe) | 1 | Surface Mount | ||
Microchip Technology | 14-VFQFN Exposed Pad | 105 °C | -40 °C | HCSL | 2.25 V | 3.63 V | Yes | No | Yes | 100 MHz | 3.2 mm | 2.5 mm | 14-QFN | 1 | 2 | PCI Express (PCIe) | 1 | Surface Mount | ||
Microchip Technology | 14-VFQFN Exposed Pad | 85 °C | -40 °C | HCSL LVDS | 2.25 V | 3.63 V | Yes | No | Yes | 100 MHz | 3.2 mm | 2.5 mm | 14-QFN | 1 | 2 | PCI Express (PCIe) | 1 | Surface Mount | ||
Microchip Technology | 14-VFQFN Exposed Pad | 85 °C | -40 °C | HCSL LVCMOS LVDS | 2.25 V | 3.63 V | Yes | No | Yes | 100 MHz | 3.2 mm | 2.5 mm | 14-QFN | 1 | 2 | PCI Express (PCIe) | 1 | Surface Mount | ||
Microchip Technology | 14-VFQFN Exposed Pad | 105 °C | -40 °C | HCSL LVDS | 2.25 V | 3.63 V | Yes | No | Yes | 100 MHz | 3.2 mm | 2.5 mm | 14-QFN | 0 | 2 | PCI Express (PCIe) | 1 | Surface Mount | Automotive | AEC-Q100 |
Microchip Technology | 14-VFQFN Exposed Pad | 85 °C | -40 °C | HCSL LVDS | 2.25 V | 3.63 V | Yes | No | Yes | 100 MHz | 3.2 mm | 2.5 mm | 14-QFN | 1 | 2 | PCI Express (PCIe) | 1 | Surface Mount | ||
Microchip Technology | 14-VFQFN Exposed Pad | 105 °C | -40 °C | HCSL LVCMOS LVDS | 2.25 V | 3.63 V | Yes | No | Yes | 100 MHz | 3.2 mm | 2.5 mm | 14-QFN | 1 | 2 | PCI Express (PCIe) | 1 | Surface Mount | ||
Microchip Technology | 14-VFQFN Exposed Pad | 85 °C | -40 °C | HCSL LVCMOS LVDS | 2.25 V | 3.63 V | Yes | No | Yes | 100 MHz | 3.2 mm | 2.5 mm | 14-QFN | 1 | 2 | PCI Express (PCIe) | 1 | Surface Mount | ||
Microchip Technology | 14-VFQFN Exposed Pad | 105 °C | -40 °C | HCSL LVCMOS LVDS | 2.25 V | 3.63 V | Yes | No | Yes | 100 MHz | 3.2 mm | 2.5 mm | 14-QFN | 1 | 2 | PCI Express (PCIe) | 1 | Surface Mount |