CONN IC DIP SOCKET 32POS GOLD
| Part | Features | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Termination Post Length | Termination Post Length | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Termination | Contact Material - Mating | Contact Material - Post [custom] | Type | Type | Type | Contact Finish - Mating | Housing Material | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] | Pitch - Post | Pitch - Post | Contact Finish - Post | Operating Temperature [Max] | Operating Temperature [Min] | Material Flammability Rating | Pitch - Mating | Pitch - Mating | Current Rating (Amps) | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Closed Frame | 200 µin | 5.08 µm | 3.56 mm | 0.14 in | 30 Áin | 0.76 Ám | Solder | Beryllium Copper | Brass | DIP | 0.6 in | 15.24 mm | Gold | Glass Filled Nylon 4/6 Polyamide (PA46) | 2 x 16 | 32 | 2.54 mm | 0.1 in | Tin | 105 ░C | -55 °C | UL94 V-0 | 0.1 in | 2.54 mm | 3 A | |
Aries Electronics | Closed Frame | 10 çin | 0.25 çm | 3.68 mm | 0.145 " | 10 çin | 0.25 çm | Solder | Phosphor Bronze | DIP | 0.6 in | 15.24 mm | Gold | Polyamide (PA46) Nylon 4/6 | 2 x 16 | 32 | 2.54 mm | 0.1 in | Gold | UL94 V-0 | 0.1 in | 2.54 mm | 1.5 A | Phosphor Bronze |