ESQT-123 Series

Catalog

CONN SOCKET 69POS 0.079 GOLD PCB

Part	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Material Flammability Rating	Connector Type	Number of Positions Loaded	Insulation Color	Pitch - Mating [x]	Pitch - Mating [x]	Contact Material	Contact Length - Post	Contact Length - Post	Fastening Type	Mounting Type	Row Spacing - Mating	Row Spacing - Mating	Number of Positions	Current Rating (Amps)	Contact Type	Operating Temperature [Min]	Operating Temperature [Max]	Contact Finish - Mating	Style	Contact Finish - Post	Number of Rows	Insulation Height	Insulation Height	Contact Shape	Termination	Insulation Material	Contact Length - Post [x]	Contact Length - Post [x]	Contact Finish Thickness - Post	Contact Finish Thickness - Post
Samtec Inc. ESQT-123-03-F-T-375	3 µin	0.076 µm	UL94 V-0	Elevated Socket	All	Black	0.079 in	2 mm	Phosphor Bronze	0.083 in	2.11 mm	Push-Pull	Through Hole	0.079 in	2 mm	69	4.5 A	Forked	-55 °C	125 °C	Gold	Board to Board Cable	Tin	3	0.375 in	9.53 mm	Square	Solder	Liquid Crystal Polymer (LCP)
Samtec Inc. ESQT-123-02-F-D-310	3 µin	0.076 µm	UL94 V-0	Elevated Socket	All	Black	0.079 in	2 mm	Phosphor Bronze	0.54 in	13.72 mm	Push-Pull	Through Hole	0.079 in	2 mm	46	4.5 A	Forked	-55 °C	125 °C	Gold	Board to Board Cable	Tin	2	0.31 in	7.87 mm	Square	Solder	Liquid Crystal Polymer (LCP)
Samtec Inc. ESQT-123-03-F-Q-310	3 µin	0.076 µm	UL94 V-0	Elevated Socket	All	Black	0.079 in	2 mm	Phosphor Bronze	0.148 in	3.76 mm	Push-Pull	Through Hole	0.079 in	2 mm	92	4.5 A	Forked	-55 °C	125 °C	Gold	Board to Board Cable	Tin		0.31 in	7.87 mm	Square	Solder	Liquid Crystal Polymer (LCP)
Samtec Inc. ESQT-123-02-L-5-720	10 çin	0.25 çm	UL94 V-0	Elevated Socket	All	Black	0.079 in	2 mm	Phosphor Bronze	0.13 in	3.3 mm	Push-Pull	Through Hole	0.079 in	2 mm	115	4.5 A	Forked	-55 °C	125 °C	Gold	Board to Board Cable	Tin	5	0.72 in	18.3 mm	Square	Solder	Liquid Crystal Polymer (LCP)
Samtec Inc. ESQT-123-02-G-Q-368	20 µin	0.51 µm	UL94 V-0	Elevated Socket	All	Black	0.079 in	2 mm	Phosphor Bronze			Push-Pull	Through Hole	0.079 in	2 mm	92	4.5 A	Forked	-55 °C	125 °C	Gold	Board to Board Cable	Gold		0.368 in	9.35 mm	Square	Solder	Liquid Crystal Polymer (LCP)	0.482 in	12.24 mm	3 µin	0.076 µm
Samtec Inc. ESQT-123-03-G-D-313	20 µin	0.51 µm	UL94 V-0	Elevated Socket	All	Black	0.079 in	2 mm	Phosphor Bronze	0.145 in	3.68 mm	Push-Pull	Through Hole	0.079 in	2 mm	46	4.5 A	Forked	-55 °C	125 °C	Gold	Board to Board Cable	Gold	2	0.313 in	7.95 mm	Square	Solder	Liquid Crystal Polymer (LCP)			3 µin	0.076 µm
Samtec Inc. ESQT-123-02-G-T-375	20 µin	0.51 µm	UL94 V-0	Elevated Socket	All	Black	0.079 in	2 mm	Phosphor Bronze			Push-Pull	Through Hole	0.079 in	2 mm	69	4.5 A	Forked	-55 °C	125 °C	Gold	Board to Board Cable	Gold	3	0.375 in	9.53 mm	Square	Solder	Liquid Crystal Polymer (LCP)	0.475 in	12.07 mm	3 µin	0.076 µm
Samtec Inc. ESQT-123-03-LM-D-310	10 çin	0.25 çm	UL94 V-0	Elevated Socket	All	Black	0.079 in	2 mm	Phosphor Bronze	0.148 in	3.76 mm	Push-Pull	Through Hole	0.079 in	2 mm	46	4.5 A	Forked	-55 °C	125 °C	Gold	Board to Board Cable	Tin	2	0.31 in	7.87 mm	Square	Solder	Liquid Crystal Polymer (LCP)
Samtec Inc. ESQT-123-03-M-Q-309	20 µin	0.51 µm	UL94 V-0	Elevated Socket	All	Black	0.079 in	2 mm	Phosphor Bronze			Push-Pull	Through Hole	0.079 in	2 mm	92	4.5 A	Forked	-55 °C	125 °C	Gold	Board to Board Cable	Tin		0.309 in	7.85 mm	Square	Solder	Liquid Crystal Polymer (LCP)	0.149 in	3.78 mm