Catalog
Headers & Wire Housings .100" Socket Strip, Press-Fit
Headers & Wire Housings .100" Socket Strip, Press-Fit
| Part | Contact Finish - Mating | Pitch - Mating | Number of Positions Loaded | Insulation Height | Contact Finish - Post | Operating Temperature (Max) | Operating Temperature (Min) | Mounting Type | Fastening Type | Number of Rows | Number of Positions | Current Rating (Per Contact) | Contact Finish Thickness - Mating | Insulation Color | Termination | Connector Type | Style | Contact Length - Post | Contact Type | Material Flammability Rating | Contact Material | Contact Shape | Insulation Material | Row Spacing - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | Gold | 0.1 in | All | 0.535 in | Tin | 125 °C | -55 °C | Through Hole | Push-Pull | 1 | 40 | 4.8 A | 10 µin | Black | Press-Fit Solder | Receptacle | Board | 0.123 in | Forked | UL94 V-0 | Phosphor Bronze | Square | Liquid Crystal Polymer (LCP) | |
Samtec Inc. | Gold | 0.335 in | Tin | 125 °C | -55 °C | Through Hole | Push-Pull | 1 | 1 | 4.8 A | 10 µin | Black | Press-Fit Solder | Receptacle | Board | 0.123 in | Forked | UL94 V-0 | Phosphor Bronze | Square | Liquid Crystal Polymer (LCP) | |||
Samtec Inc. | Gold | 0.1 in | All | 0.335 in | Tin | 125 °C | -55 °C | Through Hole | Push-Pull | 2 | 64 | 4.8 A | 30 µin | Black | Press-Fit Solder | Receptacle | Board | 0.123 in | Forked | UL94 V-0 | 0.1 in | |||
Samtec Inc. | Gold | 0.1 in | All | 0.635 in | Tin | 125 °C | -55 °C | Through Hole | Push-Pull | 2 | 6 | 4.8 A | 10 µin | Black | Press-Fit Solder | Receptacle | Board | 0.123 in | Forked | UL94 V-0 | Phosphor Bronze | Square | Liquid Crystal Polymer (LCP) | 0.1 in |
Samtec Inc. | Gold | 0.1 in | All | 0.435 in | Tin | 125 °C | -55 °C | Through Hole | Push-Pull | 1 | 8 | 4.8 A | 30 µin | Black | Press-Fit Solder | Receptacle | Board | 0.123 in | Forked | UL94 V-0 | Phosphor Bronze | Square | Liquid Crystal Polymer (LCP) | |
Samtec Inc. | Gold | 0.1 in | All | 0.335 in | Tin | 125 °C | -55 °C | Through Hole | Push-Pull | 1 | 20 | 4.8 A | 10 µin | Black | Press-Fit Solder | Receptacle | Board | 0.123 in | Forked | UL94 V-0 | Phosphor Bronze | Square | Liquid Crystal Polymer (LCP) | |
Samtec Inc. | Gold | 0.1 in | All | 0.635 in | Tin | 125 °C | -55 °C | Through Hole | Push-Pull | 1 | 4 | 4.8 A | 30 µin | Black | Press-Fit Solder | Receptacle | Board | 0.123 in | Forked | UL94 V-0 | Phosphor Bronze | Square | Liquid Crystal Polymer (LCP) | |
Samtec Inc. | Gold | 0.1 in | All | 0.335 in | Tin | 125 °C | -55 °C | Through Hole | Push-Pull | 2 | 16 | 4.8 A | 10 µin | Black | Press-Fit Solder | Receptacle | Board | 0.123 in | Forked | UL94 V-0 | Phosphor Bronze | Square | Liquid Crystal Polymer (LCP) | 0.1 in |
Samtec Inc. | Gold | 0.1 in | All | 0.335 in | Tin | 125 °C | -55 °C | Through Hole | Push-Pull | 1 | 3 | 4.8 A | 10 µin | Black | Press-Fit Solder | Receptacle | Board | 0.123 in | Forked | UL94 V-0 | ||||
Samtec Inc. | Gold | 0.1 in | All | 0.535 in | Tin | 125 °C | -55 °C | Through Hole | Push-Pull | 1 | 3 | 4.8 A | 10 µin | Black | Press-Fit Solder | Receptacle | Board | 0.123 in | Forked | UL94 V-0 | Phosphor Bronze | Square | Liquid Crystal Polymer (LCP) |