CONN IC DIP SOCKET 30POS GOLD
| Part | Housing Material | Current Rating (Amps) | Contact Material - Mating | Contact Material - Post [custom] | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Termination Post Length | Termination Post Length | Material Flammability Rating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Type | Type | Type | Mounting Type | Features | Contact Finish - Post | Pitch - Mating | Pitch - Mating | Pitch - Post | Pitch - Post | Number of Positions or Pins (Grid) | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] | Termination | Operating Temperature [Max] | Operating Temperature [Min] | Contact Finish - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Glass Filled Nylon 4/6 Polyamide (PA46) | 3 A | Beryllium Copper | Brass | 10 çin | 0.25 çm | 3.18 mm | 0.125 in | UL94 V-0 | 200 µin | 5.08 µm | 22.86 mm | DIP | 0.9 in | Through Hole | Closed Frame | Tin | 0.1 in | 2.54 mm | 2.54 mm | 0.1 in | 30 | 2 | 15 | Solder | 105 ░C | -55 °C | Gold |
Aries Electronics | Glass Filled Nylon 4/6 Polyamide (PA46) | 3 A | Beryllium Copper | Brass | 10 çin | 0.25 çm | 3.18 mm | 0.125 in | UL94 V-0 | 200 µin | 5.08 µm | 22.86 mm | DIP | 0.9 in | Through Hole | Closed Frame | Tin | 0.1 in | 2.54 mm | 2.54 mm | 0.1 in | 30 | 2 | 15 | Solder | 105 ░C | -55 °C | Gold |