30-9513 Series

Catalog

CONN IC DIP SOCKET 30POS GOLD

Part	Material Flammability Rating	Termination Post Length	Current Rating	Row Spacing	Type	Contact Material - Post	Contact Material - Mating	Contact Finish - Post	Pitch - Post	Mounting Type	Pitch - Mating	Termination	Contact Finish Thickness - Post	Features	Contact Finish - Mating	Housing Material	Operating Temperature (Min)	Operating Temperature (Max)	Contact Finish Thickness - Mating	Grid Rows	Number of Positions or Pins (Grid)	Grid Columns
Aries Electronics 30-9513-10T	UL94 V-0	0.125 in	3 A	0.9 in	0.9" (22.86mm) Row Spacing DIP	Brass	Beryllium Copper	Tin	0.1 in	Through Hole	0.1 in	Solder	200 µin	Closed Frame	Gold	Glass Filled Nylon 4/6 PA46 Polyamide	-55 °C	105 °C	10 µin	2	30	15
Aries Electronics 30-9513-11	UL94 V-0	0.125 in	3 A	0.9 in	0.9" (22.86mm) Row Spacing DIP	Brass	Beryllium Copper	Gold	0.1 in	Through Hole	0.1 in	Solder	10 µin	Closed Frame	Gold	Glass Filled Nylon 4/6 PA46 Polyamide	-55 °C	105 °C	10 µin	2	30	15
Aries Electronics 30-9513-10H	UL94 V-0	0.125 in	3 A	0.9 in	0.9" (22.86mm) Row Spacing DIP	Brass	Beryllium Copper	Tin	0.1 in	Through Hole	0.1 in	Solder	200 µin	Closed Frame	Gold	Glass Filled Nylon 4/6 PA46 Polyamide	-55 °C	105 °C	10 µin	2	30	15