DSC1033 Series
Manufacturer: Microchip Technology
MEMS OSC XO 12.0000MHZ CMOS SMD
| Part | Current - Supply (Disable) (Max) | Voltage - Supply | Package Width | Package Name | Package Length | Size / Dimension Length | Size / Dimension Width | Mounting Type | Frequency Stability | Package / Case | Frequency | Base Resonator | Voltage - Supply (Maximum) | Voltage - Supply (Minimum) | Function | Type | Current - Supply (Max) | Output | Height - Seated (Max) | Operating Temperature (Max) | Operating Temperature (Min) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology | 1 µA | 3.3 V | 3.2 mm | 4-SMD | 5 mm | 0.197 in | 0.126 in | Surface Mount | 25 ppm | 4-SMD No Lead | 12 MHz | MEMS | 3.6 V | 3 V | Standby (Power Down) | XO (Standard) | 3 mA | CMOS | 0.035 in | 70 °C | -20 °C |
Microchip Technology | 1 µA | 3.3 V | 2.5 mm | 4-VDFN | 3.2 mm | 0.126 in | 0.098 in | Surface Mount | 25 ppm | 4-SMD No Lead | 12 MHz | MEMS | 3.6 V | 3 V | Standby (Power Down) | XO (Standard) | 10 mA | CMOS | 0.035 in | 70 °C | 0 °C |
Microchip Technology | 1 µA | 3.3 V | 3.2 mm | 4-SMD | 5 mm | 0.197 in | 0.126 in | Surface Mount | 50 ppm | 4-SMD No Lead | 4.0625 MHz | MEMS | 3.6 V | 3 V | Standby (Power Down) | XO (Standard) | 10 mA | CMOS | 0.035 in | 70 °C | -20 °C |
Microchip Technology | 1 µA | 3.3 V | 0.276 in | 0.197 in | Surface Mount | 50 ppm | 4-SMD No Lead Exposed Pad | 25 MHz | MEMS | 3.6 V | 3 V | Standby (Power Down) | XO (Standard) | 3 mA | CMOS | 0.035 in | 70 °C | 0 °C | |||
Microchip Technology | 1 µA | 3.3 V | 0.276 in | 0.197 in | Surface Mount | 50 ppm | 4-SMD No Lead Exposed Pad | 8 MHz | MEMS | 3.6 V | 3 V | Standby (Power Down) | XO (Standard) | 3 mA | CMOS | 0.035 in | 70 °C | 0 °C | |||
Microchip Technology | 1 µA | 3.3 V | 2.5 mm | 4-VDFN | 3.2 mm | 0.126 in | 0.098 in | Surface Mount | 25 ppm | 4-SMD No Lead | 25 MHz | MEMS | 3.6 V | 3 V | Standby (Power Down) | XO (Standard) | 10 mA | CMOS | 0.035 in | 70 °C | -20 °C |
Microchip Technology | 1 µA | 3.3 V | 0.276 in | 0.197 in | Surface Mount | 50 ppm | 4-SMD No Lead Exposed Pad | 25 MHz | MEMS | 3.6 V | 3 V | Standby (Power Down) | XO (Standard) | 3 mA | CMOS | 0.035 in | 70 °C | 0 °C | |||
Microchip Technology | 1 µA | 3.3 V | 0.098 in | 0.079 in | Surface Mount | 25 ppm | 4-SMD No Lead | 25 MHz | MEMS | 3.6 V | 3 V | Standby (Power Down) | XO (Standard) | 3 mA | CMOS | 0.035 in | 85 °C | -40 °C | |||
Microchip Technology | 1 µA | 3.3 V | 0.098 in | 0.079 in | Surface Mount | 25 ppm | 4-SMD No Lead | 5.12 MHz | MEMS | 3.6 V | 3 V | Standby (Power Down) | XO (Standard) | 3 mA | CMOS | 0.035 in | 85 °C | -40 °C | |||
Microchip Technology | 1 µA | 3.3 V | 0.098 in | 0.079 in | Surface Mount | 25 ppm | 4-SMD No Lead | 25 MHz | MEMS | 3.6 V | 3 V | Standby (Power Down) | XO (Standard) | 4 mA | CMOS | 0.035 in | 70 °C | 0 °C |