HLE-106 Series
Manufacturer: Samtec Inc.
CONN RCPT 12POS 0.1 GOLD SMD
| Part | Operating Temperature (Max) | Operating Temperature (Min) | Current Rating (Per Contact) | Style | Insulation Height | Contact Finish - Mating | Contact Finish - Post | Termination | Row Spacing - Mating | Contact Type | Mounting Type | Features | Insulation Color | Number of Positions | Connector Type | Number of Positions Loaded | Contact Finish Thickness - Mating | Fastening Type | Number of Rows | Pitch - Mating | Voltage Rating | Insulation Material | Contact Shape | Contact Material | Contact Finish Thickness - Post | Contact Length - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | 125 °C | -55 °C | 4.1 A | Board | 0.144 in | Gold | Tin | Solder | 0.1 in | Female Socket | Surface Mount | Board Guide | Black | 12 | Bottom Entry Receptacle | All | 30 µin | Push-Pull | 2 | 0.1 in | 400 V | Liquid Crystal Polymer (LCP) | Square | Beryllium Copper | ||
Samtec Inc. | 125 °C | -55 °C | 4.1 A | Board | 0.144 in | Gold | Gold | Solder | 0.1 in | Female Socket | Surface Mount | Board Guide | Black | 12 | Receptacle | All | 20 Ąin | Push-Pull | 2 | 0.1 in | 400 V | Liquid Crystal Polymer (LCP) | Square | Beryllium Copper | 3 µin | |
Samtec Inc. | 125 °C | -55 °C | 4.1 A | Board | 0.144 in | Gold | Gold | Solder | 0.1 in | Female Socket | Surface Mount | Board Lock Pick and Place | Black | 12 | Receptacle | All | 20 Ąin | Push-Pull | 2 | 0.1 in | 400 V | Liquid Crystal Polymer (LCP) | Square | Beryllium Copper | 3 µin | |
Samtec Inc. | 125 °C | -55 °C | 4.1 A | Board | 0.144 in | Gold | Tin | Solder | 0.1 in | Female Socket | Surface Mount | Black | 12 | Bottom Entry Receptacle | All | 3 µin | Push-Pull | 2 | 0.1 in | 400 V | Liquid Crystal Polymer (LCP) | Square | Beryllium Copper | |||
Samtec Inc. | 125 °C | -55 °C | 4.1 A | Board | 0.144 in | Gold | Gold | Solder | 0.1 in | Female Socket | Surface Mount | Board Guide Pick and Place | Black | 12 | Receptacle | All | 20 Ąin | Push-Pull | 2 | 0.1 in | 400 V | Liquid Crystal Polymer (LCP) | Square | Beryllium Copper | 3 µin | |
Samtec Inc. | 125 °C | -55 °C | 4.1 A | Board | 0.138 in | Gold | Tin | Solder | 0.1 in | Female Socket | Through Hole | Pick and Place | Black | 12 | Receptacle | All | 10 µin | Push-Pull | 2 | 0.1 in | 400 V | Liquid Crystal Polymer (LCP) | Square | Beryllium Copper | 0.12 in | |
Samtec Inc. | 125 °C | -55 °C | 4.1 A | Board | 0.144 in | Gold | Tin | Solder | 0.1 in | Female Socket | Surface Mount | Board Guide Pick and Place | Black | 12 | Bottom Entry Receptacle | All | 10 µin | Push-Pull | 2 | 0.1 in | 400 V | Liquid Crystal Polymer (LCP) | Square | Beryllium Copper | ||
Samtec Inc. | 125 °C | -55 °C | 4.1 A | Board | 0.138 in | Gold | Tin | Solder | 0.1 in | Female Socket | Through Hole | Black | 12 | Pass Through Receptacle | All | 30 µin | Push-Pull | 2 | 0.1 in | 400 V | Liquid Crystal Polymer (LCP) | Square | Beryllium Copper | 0.09 in | ||
Samtec Inc. | 125 °C | -55 °C | 4.1 A | Board | 0.144 in | Gold | Tin | Solder | 0.1 in | Female Socket | Surface Mount | Board Guide Pick and Place | Black | 12 | Bottom Entry Receptacle | All | 3 µin | Push-Pull | 2 | 0.1 in | 400 V | Liquid Crystal Polymer (LCP) | Square | Beryllium Copper | ||
Samtec Inc. | 125 °C | -55 °C | 4.1 A | Board | 0.138 in | Gold | Tin | Solder | 0.1 in | Female Socket | Through Hole | Board Lock | Black | 12 | Bottom Entry Pass Through Receptacle | All | 30 µin | Push-Pull | 2 | 0.1 in | 400 V | Liquid Crystal Polymer (LCP) | Square | Beryllium Copper | 0.09 in |