MC34903 Series
Manufacturer: NXP USA Inc.
IC SBC HIGH SPD CAN 3.3V 32SOIC
| Part | Mounting Type | Voltage - Supply (Maximum) | Voltage - Supply (Minimum) | Operating Temperature (Max) | Operating Temperature (Min) | Current - Supply | Applications | Package Name | Package Width | Package Features | Package Length |
|---|---|---|---|---|---|---|---|---|---|---|---|
NXP USA Inc. | Surface Mount | 28 V | 5.5 V | 125 °C | -40 °C | 2 mA | System Basis Chip | 32-SOIC-EP 32-SSOP | 7.5 mm | Exposed Pad | 0.295 in |
NXP USA Inc. | Surface Mount | 28 V | 5.5 V | 125 °C | -40 °C | 2 mA | System Basis Chip | 32-SOIC-EP 32-SSOP | 7.5 mm | Exposed Pad | 0.295 in |
NXP USA Inc. | Surface Mount | 28 V | 5.5 V | 125 °C | -40 °C | 2 mA | System Basis Chip | 32-SOIC-EP 32-SSOP | 7.5 mm | Exposed Pad | 0.295 in |
NXP USA Inc. | Surface Mount | 28 V | 5.5 V | 125 °C | -40 °C | 2 mA | System Basis Chip | 32-SOIC-EP 32-SSOP | 7.5 mm | Exposed Pad | 0.295 in |
NXP USA Inc. | Surface Mount | 28 V | 5.5 V | 125 °C | -40 °C | 2 mA | System Basis Chip | 32-SOIC-EP 32-SSOP | 7.5 mm | Exposed Pad | 0.295 in |
NXP USA Inc. | Surface Mount | 28 V | 5.5 V | 125 °C | -40 °C | 2 mA | System Basis Chip | 32-SOIC-EP 32-SSOP | 7.5 mm | Exposed Pad | 0.295 in |
NXP USA Inc. | Surface Mount | 28 V | 5.5 V | 125 °C | -40 °C | 2 mA | System Basis Chip | 32-SOIC-EP 32-SSOP | 7.5 mm | Exposed Pad | 0.295 in |
NXP USA Inc. | Surface Mount | 28 V | 5.5 V | 125 °C | -40 °C | 2 mA | System Basis Chip | 32-SOIC-EP 32-SSOP | 7.5 mm | Exposed Pad | 0.295 in |