SQT-111 Series
Manufacturer: Samtec Inc.
CONN RCPT 11POS 0.079 GOLD PCB
| Part | Contact Length - Post | Connector Type | Number of Positions | Current Rating (Per Contact) | Operating Temperature (Max) | Operating Temperature (Min) | Number of Positions Loaded | Termination | Contact Finish Thickness - Mating | Fastening Type | Insulation Height | Number of Rows | Contact Type | Style | Material Flammability Rating | Contact Finish - Post | Pitch - Mating | Mounting Type | Insulation Color | Contact Finish - Mating | Contact Material | Insulation Material | Contact Shape | Row Spacing - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Post | Number of Positions Loaded |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | 0.208 in | Receptacle | 11 | 5.1 A | 125 °C | -55 °C | All | Solder | Flash | Push-Pull | 0.25 in | 1 | Forked | Board Board or Cable | UL94 V-0 | Tin | 0.079 in | Through Hole | Black | Gold | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Square | ||||
Samtec Inc. | 0.09 in | Receptacle | 44 | 5.1 A | 125 °C | -55 °C | All | Solder | Push-Pull | 0.25 in | 4 | Forked | Board Board or Cable | UL94 V-0 | Tin | 0.079 in | Through Hole | Black | Gold | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Square | 0.079 in | 30 µin | |||
Samtec Inc. | 0.6 in | Receptacle | 22 | 5.1 A | 125 °C | -55 °C | All | Solder | Flash | Push-Pull | 0.25 in | 2 | Forked | Board Board or Cable | UL94 V-0 | Tin | 0.079 in | Through Hole | Black | Gold | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Square | 0.079 in | |||
Samtec Inc. | 0.208 in | Receptacle | 22 | 5.1 A | 125 °C | -55 °C | All | Solder | Push-Pull | 0.25 in | 2 | Forked | Board Board or Cable | UL94 V-0 | Tin | 0.079 in | Through Hole | Black | Gold | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Square | 0.079 in | 30 µin | |||
Samtec Inc. | 0.09 in | Receptacle | 33 | 5.1 A | 125 °C | -55 °C | All | Solder | Push-Pull | 0.25 in | 3 | Forked | Board Board or Cable | UL94 V-0 | Gold | 0.079 in | Through Hole | Black | Gold | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Square | 0.079 in | 50 µin | 3 µin | ||
Samtec Inc. | 0.208 in | Receptacle | 11 | 5.1 A | 125 °C | -55 °C | All | Solder | Push-Pull | 0.25 in | 1 | Forked | Board Board or Cable | UL94 V-0 | Tin | 0.079 in | Through Hole | Black | Gold | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Square | 10 µin | ||||
Samtec Inc. | 0.208 in | Receptacle | 33 | 5.1 A | 125 °C | -55 °C | All | Solder | Flash | Push-Pull | 0.25 in | 3 | Forked | Board Board or Cable | UL94 V-0 | Tin | 0.079 in | Through Hole | Black | Gold | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Square | 0.079 in | |||
Samtec Inc. | 0.09 in | Receptacle | 11 | 5.1 A | 125 °C | -55 °C | All | Solder | Push-Pull | 0.079 in | 1 | Forked | Board Board or Cable | UL94 V-0 | Tin | 0.079 in | Right Angle Through Hole | Black | Gold | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Square | 10 µin | ||||
Samtec Inc. | 0.09 in | Receptacle | 22 | 5.1 A | 125 °C | -55 °C | Solder | Flash | Push-Pull | 0.25 in | 2 | Forked | Board Board or Cable | UL94 V-0 | Tin | 0.079 in | Through Hole | Black | Gold | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Square | 0.079 in | 21 | |||
Samtec Inc. | 0.09 in | Receptacle | 22 | 5.1 A | 125 °C | -55 °C | All | Solder | Push-Pull | 0.157 in | 2 | Forked | Board Board or Cable | UL94 V-0 | Tin | 0.079 in | Right Angle Through Hole | Black | Gold | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Square | 0.079 in | 10 µin |