MCP47CVB02 Series

Catalog

I2C, DUAL CHANNEL, 8-BIT, VOLATILE 16 QFN 3X3X0.9MM T/R ROHS COMPLIANT: YES

Part	Output Type	Package Width	Package Name	Package Length	Voltage - Supply, Digital (Max)	Voltage - Supply, Digital (Min)	Settling Time (Typical)	Differential Output	Mounting Type	Number of Bits	Architecture	Data Interface	DNL (Max) (LSB)	DNL (LSB) Tolerance	INL (Max) (LSB)	INL (LSB) Tolerance	Operating Temperature (Max)	Operating Temperature (Min)	Voltage - Supply, Analog (Min)	Voltage - Supply, Analog (Max)	Number of D/A Converters	Reference Type	Package / Case
Microchip Technology MCP47CVB02T-E/MG	Voltage - Buffered	3 mm	16-QFN	3 mm	5.5 V	1.8 V	16 µs	No	Surface Mount	8 bits	Current Source	I2C	0.1 LSB 0.1 LSB	0.1 LSB 0.1 LSB	0.1 LSB	0.1 LSB	125 °C	-40 °C	1.8 V	5.5 V	2 count	External Internal	16-VFQFN Exposed Pad
Microchip Technology MCP47CVB02T-E/UN	Voltage - Buffered	3 mm	10-MSOP 10-TFSOP	0.118 in	5.5 V	1.8 V	16 µs	No	Surface Mount	8 bits	Current Source	I2C	0.1 LSB 0.1 LSB	0.1 LSB 0.1 LSB	0.1 LSB	0.1 LSB	125 °C	-40 °C	1.8 V	5.5 V	2 count	External Internal
Microchip Technology MCP47CVB02T-E/MF	Voltage - Buffered	3 mm	10-DFN	3 mm	5.5 V	1.8 V	16 µs	No	Surface Mount	8 bits	Current Source	I2C	0.1 LSB 0.1 LSB	0.1 LSB 0.1 LSB	0.1 LSB	0.1 LSB	125 °C	-40 °C	1.8 V	5.5 V	2 count	External Internal	10-VFDFN Exposed Pad
Microchip Technology MCP47CVB02-E/MG	Voltage - Buffered	3 mm	16-QFN	3 mm	5.5 V	1.8 V	16 µs	No	Surface Mount	8 bits	Current Source	I2C		0.1 LSB		0.1 LSB	125 °C	-40 °C	1.8 V	5.5 V	2 count	External Internal	16-VFQFN Exposed Pad
Microchip Technology MCP47CVB02-E/MF	Voltage - Buffered	3 mm	10-DFN	3 mm	5.5 V	1.8 V	16 µs	No	Surface Mount	8 bits	Current Source	I2C		0.1 LSB		0.1 LSB	125 °C	-40 °C	1.8 V	5.5 V	2 count	External Internal	10-VFDFN Exposed Pad
Microchip Technology MCP47CVB02-E/UN	Voltage - Buffered	3 mm	10-MSOP 10-TFSOP	0.118 in	5.5 V	1.8 V	16 µs	No	Surface Mount	8 bits	Current Source	I2C		0.1 LSB		0.1 LSB	125 °C	-40 °C	1.8 V	5.5 V	2 count	External Internal