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CONN IC DIP SOCKET 18POS GOLD
| Part | Pitch - Post | Pitch - Post | Contact Material - Mating | Housing Material | Termination | Operating Temperature [Min] | Operating Temperature [Max] | Contact Finish - Post | Type | Type | Type | Number of Positions or Pins (Grid) | Material Flammability Rating | Features | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Current Rating (Amps) | Mounting Type | Termination Post Length | Termination Post Length | Contact Material - Post | Pitch - Mating | Pitch - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Finish - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 2.54 mm | 0.1 in | Phosphor Bronze | Glass Filled Nylon 4/6 Polyamide (PA46) | Solder | -55 °C | 125 °C | Gold | 0.3 " | 7.62 mm | DIP | 18 | UL94 V-0 | Closed Frame | 10 çin | 0.25 çm | 1 A | Through Hole | 0.15 in | 3.81 mm | Phosphor Bronze | 0.1 in | 2.54 mm | 10 çin | 0.25 çm | Gold |
Aries Electronics | 2.54 mm | 0.1 in | Phosphor Bronze | Glass Filled Nylon 4/6 Polyamide (PA46) | Solder | -55 °C | 105 ░C | Tin | 0.3 " | 7.62 mm | DIP | 18 | UL94 V-0 | Closed Frame | 200 µin | 5.08 µm | 1 A | Through Hole | 0.15 in | 3.81 mm | Phosphor Bronze | 0.1 in | 2.54 mm | 200 µin | 5.08 µm |