MPC8306 Series
Manufacturer: NXP USA Inc.
IC MPU MPC83XX 133MHZ 369BGA
| Part | Additional Interfaces | RAM Controllers | Co-Processors/DSP | Bus Width | Number of Cores | Package / Case | Voltage - I/O (Option 2) | Voltage - I/O (Option 1) | Speed | Operating Temperature (Max) | Operating Temperature (Min) | USB 2.0 Count | USB | Mounting Type | Ethernet Ports | Ethernet Speed Options | Core Processor | Package Name | Package Width | Package Length | Graphics Acceleration |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP USA Inc. | DUART I2C SPI TDM | DDR2 | Communications QUICC Engine | 32 Bit | 1 Core | 369-LFBGA | 3.3 V | 1.8 V | 133 MHz | 105 °C | -40 °C | 1 count | USB 2.0 | Surface Mount | 3 | 100Mbps 10Mbps | PowerPC e300c3 | 369-PBGA | 19 mm | 19 mm | No |
NXP USA Inc. | DUART I2C SPI TDM | DDR2 | Communications QUICC Engine | 32 Bit | 1 Core | 369-LFBGA | 3.3 V | 1.8 V | 266 MHz | 105 °C | -40 °C | 1 count | USB 2.0 | Surface Mount | 3 | 100Mbps 10Mbps | PowerPC e300c3 | 369-PBGA | 19 mm | 19 mm | No |
NXP USA Inc. | DUART I2C SPI TDM | DDR2 | Communications QUICC Engine | 32 Bit | 1 Core | 369-LFBGA | 3.3 V | 1.8 V | 266 MHz | 105 °C | -40 °C | 1 count | USB 2.0 | Surface Mount | 3 | 100Mbps 10Mbps | PowerPC e300c3 | 369-PBGA | 19 mm | 19 mm | No |
NXP USA Inc. | DUART I2C SPI TDM | DDR2 | Communications QUICC Engine | 32 Bit | 1 Core | 369-LFBGA | 3.3 V | 1.8 V | 266 MHz | 105 °C | 0 °C | 1 count | USB 2.0 | Surface Mount | 3 | 100Mbps 10Mbps | PowerPC e300c3 | 369-PBGA | 19 mm | 19 mm | No |
NXP USA Inc. | DUART I2C SPI TDM | DDR2 | Communications QUICC Engine | 32 Bit | 1 Core | 369-LFBGA | 3.3 V | 1.8 V | 333 MHz | 105 °C | 0 °C | 1 count | USB 2.0 | Surface Mount | 3 | 100Mbps 10Mbps | PowerPC e300c3 | 369-PBGA | 19 mm | 19 mm | No |
NXP USA Inc. | DUART I2C SPI TDM | DDR2 | Communications QUICC Engine | 32 Bit | 1 Core | 369-LFBGA | 3.3 V | 1.8 V | 266 MHz | 105 °C | 0 °C | 1 count | USB 2.0 | Surface Mount | 3 | 100Mbps 10Mbps | PowerPC e300c3 | 369-PBGA | 19 mm | 19 mm | No |
NXP USA Inc. | DUART I2C SPI TDM | DDR2 | Communications QUICC Engine | 32 Bit | 1 Core | 369-LFBGA | 3.3 V | 1.8 V | 133 MHz | 105 °C | -40 °C | 1 count | USB 2.0 | Surface Mount | 3 | 100Mbps 10Mbps | PowerPC e300c3 | 369-PBGA | 19 mm | 19 mm | No |
NXP USA Inc. | CAN DUART I2C MMC SD SPI TDM | DDR2 | Communications QUICC Engine | 32 Bit | 1 Core | 369-LFBGA | 3.3 V | 1.8 V | 333 MHz | 105 °C | 0 °C | 1 count | USB 2.0 | Surface Mount | 3 | 100Mbps 10Mbps | PowerPC e300c3 | 369-PBGA | 19 mm | 19 mm | No |
NXP USA Inc. | DUART I2C SPI TDM | DDR2 | Communications QUICC Engine | 32 Bit | 1 Core | 369-LFBGA | 3.3 V | 1.8 V | 200 MHz | 105 °C | -40 °C | 1 count | USB 2.0 | Surface Mount | 3 | 100Mbps 10Mbps | PowerPC e300c3 | 369-PBGA | 19 mm | 19 mm | No |