CONN IC DIP SOCKET 10POS GOLD
| Part | Housing Material | Pitch - Mating | Pitch - Mating | Current Rating (Amps) | Pitch - Post | Pitch - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Features | Contact Finish - Post | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Operating Temperature [Max] | Operating Temperature [Min] | Type | Type | Type | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] | Material Flammability Rating | Contact Material - Mating | Termination | Termination Post Length | Termination Post Length | Contact Material - Post [custom] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Glass Filled Nylon 4/6 Polyamide (PA46) | 0.1 in | 2.54 mm | 3 A | 2.54 mm | 0.1 in | 200 µin | 5.08 µm | Closed Frame | Tin | Gold | 30 Áin | 0.76 Ám | 105 ░C | -55 °C | DIP | 0.6 in | 15.24 mm | 2 x 5 | 10 | UL94 V-0 | Beryllium Copper | Solder | 3.56 mm | 0.14 in | Brass |