GD25Q64 Series
Manufacturer: GigaDevice Semiconductor (HK) Limited
IC FLASH 64MBIT SPI/QUAD 8USON
| Part | Operating Temperature (Max) | Operating Temperature (Min) | Clock Frequency | Package Length | Package Width | Package Name | Memory Interface (Type) | Voltage - Supply (Maximum) | Voltage - Supply (Minimum) | Memory Width | Memory Depth | Access Time | Memory Size | Memory Type | Mounting Type | Technology | Memory Format | Write Cycle Time - Word | Write Cycle Time - Page | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
GigaDevice Semiconductor (HK) Limited | 125 °C | -40 °C | 133 MHz | 3 mm | 4 mm | 8-USON | SPI - Quad I/O | 3.6 V | 2.7 V | 8 bit | 8 M | 7 ns | 64 Mbit | Non-Volatile | Surface Mount | FLASH - NOR (SLC) | FLASH | 140 µs | 4 ms | 8-UDFN Exposed Pad |
GigaDevice Semiconductor (HK) Limited | 85 °C | -40 °C | 133 MHz | 3 mm | 4 mm | 8-USON | SPI - Quad I/O | 3.6 V | 2.7 V | 8 bit | 8 M | 7 ns | 64 Mbit | Non-Volatile | Surface Mount | FLASH - NOR (SLC) | FLASH | 70 µs | 2.4 ms | 8-UDFN Exposed Pad |
GigaDevice Semiconductor (HK) Limited | 105 °C | -40 °C | 133 MHz | 0.154 in | 3.9 mm | 8-SOIC 8-SOP | SPI - Quad I/O | 3.6 V | 2.7 V | 8 bit | 8 M | 7 ns | 64 Mbit | Non-Volatile | Surface Mount | FLASH - NOR (SLC) | FLASH | 140 µs | 4 ms | |
GigaDevice Semiconductor (HK) Limited | 125 °C | -40 °C | 133 MHz | 5 mm | 6 mm | 8-WSON | SPI - Quad I/O | 3.6 V | 2.7 V | 8 bit | 8 M | 7 ns | 64 Mbit | Non-Volatile | Surface Mount | FLASH - NOR (SLC) | FLASH | 140 µs | 4 ms | 8-WDFN Exposed Pad |
GigaDevice Semiconductor (HK) Limited | 85 °C | -40 °C | 133 MHz | 6 mm | 8 mm | 24-TFBGA | SPI - Quad I/O | 3.6 V | 2.7 V | 8 bit | 8 M | 7 ns | 64 Mbit | Non-Volatile | Surface Mount | FLASH - NOR (SLC) | FLASH | 70 µs | 2.4 ms | 24-TBGA |
GigaDevice Semiconductor (HK) Limited | 105 °C | -40 °C | 120 MHz | 5 mm | 6 mm | 8-WSON | SPI - Quad I/O | 3.6 V | 2.7 V | 8 bit | 8 M | 7 ns | 64 Mbit | Non-Volatile | Surface Mount | FLASH - NOR (SLC) | FLASH | 60 µs | 4 ms | 8-WDFN Exposed Pad |
GigaDevice Semiconductor (HK) Limited | 85 °C | -40 °C | 133 MHz | 0.154 in | 3.9 mm | 8-SOIC 8-SOP | SPI - Quad I/O | 3.6 V | 2.7 V | 8 bit | 8 M | 7 ns | 64 Mbit | Non-Volatile | Surface Mount | FLASH - NOR (SLC) | FLASH | 70 µs | 2.4 ms | |
GigaDevice Semiconductor (HK) Limited | 85 °C | -40 °C | 120 MHz | 0.26 in | 6.6 mm | 8-DIP | SPI - Quad I/O | 3.6 V | 2.7 V | 8 bit | 8 M | 64 Mbit | Non-Volatile | Surface Mount | FLASH - NOR | FLASH | 50 µs | 2.4 ms | ||
GigaDevice Semiconductor (HK) Limited | 85 °C | -40 °C | 120 MHz | 0.295 in | 7.5 mm | 16-SOIC 16-SOP | SPI - Quad I/O | 3.6 V | 2.7 V | 8 bit | 8 M | 64 Mbit | Non-Volatile | Surface Mount | FLASH - NOR | FLASH | 50 µs | 2.4 ms | ||
GigaDevice Semiconductor (HK) Limited | 125 °C | -40 °C | 133 MHz | 4 mm | 4 mm | 8-USON | SPI - Quad I/O | 3.6 V | 2.7 V | 8 bit | 8 M | 7 ns | 64 Mbit | Non-Volatile | Surface Mount | FLASH - NOR (SLC) | FLASH | 140 µs | 4 ms | 8-XDFN Exposed Pad |