KC-LINK 1812 9.1NF 1000VDC C0G
| Part | Thickness (Max) [Max] | Thickness (Max) [Max] | Features | Voltage - Rated | Voltage - Rated | Capacitance | Package / Case | Size / Dimension [y] | Size / Dimension [x] | Size / Dimension [x] | Size / Dimension [y] | Applications | Temperature Coefficient | Tolerance | Operating Temperature [Min] | Operating Temperature [Max] | Mounting Type | Thickness (Max) | Ratings | Thickness (Max) [Max] [custom] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
KEMET | 0.087 in | 2.2 mm | High Temperature High Voltage Low ESL Soft Termination | 1 kV | 1000 V | 9100 pF | 1812 (4532 Metric) | 3.2 mm | 0.177 in | 4.5 mm | 0.126 " | Boardflex Sensitive | C0G NP0 | 20 % | -55 °C | 150 °C | MLCC Surface Mount | |||
KEMET | 0.061 in | High Temperature High Voltage Low ESL Soft Termination | 1 kV | 1000 V | 6800 pF | 1812 (4532 Metric) | 3.2 mm | 0.177 in | 4.5 mm | 0.126 " | Boardflex Sensitive | C0G NP0 | 1 % | -55 °C | 150 °C | MLCC Surface Mount | 1.55 mm | |||
KEMET | 0.061 in | High Temperature High Voltage Low ESL Soft Termination | 500 V | 0.022 µF | 1812 (4532 Metric) | 3.2 mm | 0.177 in | 4.5 mm | 0.126 " | Boardflex Sensitive | C0G NP0 | 20 % | -55 °C | 150 °C | MLCC Surface Mount | 1.55 mm | ||||
KEMET | 0.087 in | 2.2 mm | High Temperature High Voltage Low ESL Soft Termination | 500 V | 0.033 çF | 1812 (4532 Metric) | 3.2 mm | 0.177 in | 4.5 mm | 0.126 " | Boardflex Sensitive | C0G NP0 | 1 % | -55 °C | 150 °C | MLCC Surface Mount | ||||
KEMET | 0.071 " | High Temperature High Voltage Low ESL Soft Termination | 500 V | 0.027 µF | 1812 (4532 Metric) | 3.2 mm | 0.177 in | 4.5 mm | 0.126 " | Boardflex Sensitive | C0G NP0 | 5 % | -55 °C | 150 °C | MLCC Surface Mount | 1.8 mm | ||||
KEMET | 0.087 in | 2.2 mm | High Temperature High Voltage Low ESL Soft Termination | 650 V | 10000 pF | 1812 (4532 Metric) | 3.2 mm | 0.177 in | 4.5 mm | 0.126 " | Boardflex Sensitive | C0G NP0 | 5 % | -55 °C | 150 °C | MLCC Surface Mount | ||||
KEMET | 0.106 " | 2.7 mm | High Temperature High Voltage Low ESL Soft Termination | 500 V | 0.012 µF | 1812 (4532 Metric) | 3.2 mm | 0.177 in | 4.5 mm | 0.126 " | Automotive Boardflex Sensitive | C0G NP0 | 10 % | -55 °C | 150 °C | MLCC Surface Mount | AEC-Q200 | |||
KEMET | 1.4 mm | High Temperature High Voltage Low ESL Soft Termination | 650 V | 4700 pF | 1812 (4532 Metric) | 3.2 mm | 0.177 in | 4.5 mm | 0.126 " | Boardflex Sensitive | C0G NP0 | 10 % | -55 °C | 150 °C | MLCC Surface Mount | 0.055 in | ||||
KEMET | 0.061 in | High Temperature High Voltage Low ESL Soft Termination | 1 kV | 1000 V | 6200 pF | 1812 (4532 Metric) | 3.2 mm | 0.177 in | 4.5 mm | 0.126 " | Automotive Boardflex Sensitive | C0G NP0 | 1 % | -55 °C | 150 °C | MLCC Surface Mount | 1.55 mm | AEC-Q200 | ||
KEMET | 1.4 mm | High Temperature High Voltage Low ESL Soft Termination | 500 V | 5600 pF | 1812 (4532 Metric) | 3.2 mm | 0.177 in | 4.5 mm | 0.126 " | Boardflex Sensitive | C0G NP0 | 20 % | -55 °C | 150 °C | MLCC Surface Mount | 0.055 in |