163A178 Series

Catalog

CONN D-SUB HD PLUG 15P R/A SLDR

Part	Contact Material	Contact Finish	Shell Size, Connector Layout [custom]	Shell Size, Connector Layout [custom]	Shell Size, Connector Layout [custom]	Features	Number of Positions	Connector Type	Mounting Type	Material Flammability Rating	Color	Contact Type	Backset Spacing	Backset Spacing	Contact Finish Thickness	Contact Finish Thickness	Voltage Rating	Flange Feature	Current Rating (Amps)	Dielectric Material	Connector Style	Number of Rows	Operating Temperature [Min]	Operating Temperature [Max]	Termination	Shell Size, Connector Layout [x]	Shell Size, Connector Layout	Shell Size, Connector Layout
Amphenol CONEC 163A17809X	Copper Alloy	Gold	DE E	1	High Density	Board Lock Grounding Indents	15	Male Pins Plug	Board Edge Right Angle Through Hole	UL94 V-0	Black	Signal	0.314 in	7.98 mm	0.51 µm	20 µin	60 VDC	Housing/Shell (M3)	3 A	Polybutylene Terephthalate (PBT) Glass Filled	D-Sub High Density	3	-55 °C	125 °C	Solder
Amphenol CONEC 163A17829X	Copper Alloy	Gold	B DB			Board Lock Grounding Indents	44	Male Pins Plug	Board Edge Right Angle Through Hole	UL94 V-0	Black	Signal	0.314 in	7.98 mm	0.51 µm	20 µin	60 VDC	Housing/Shell (M3)	3 A	Polybutylene Terephthalate (PBT) Glass Filled	D-Sub High Density	3	-55 °C	125 °C	Solder	3
Amphenol CONEC 163A17849X	Copper Alloy	Gold	DE E	1	High Density	Board Lock Grounding Indents	15	Male Pins Plug	Board Edge Right Angle Through Hole	UL94 V-0	Black	Signal	0.314 in	7.98 mm	0.203 çm	8 çin	60 VDC	4-40	3 A	Polybutylene Terephthalate (PBT) Glass Filled	D-Sub High Density	3	-55 °C	125 °C	Solder
Amphenol CONEC 163A17819X	Copper Alloy	Gold				Board Lock Grounding Indents	26	Male Pins Plug	Board Edge Right Angle Through Hole	UL94 V-0	Black	Signal	0.314 in	7.98 mm	0.51 µm	20 µin	60 VDC	Housing/Shell (M3)	3 A	Polybutylene Terephthalate (PBT) Glass Filled	D-Sub High Density	3	-55 °C	125 °C	Solder		2	(DA A) High Density