CONN IC DIP SOCKET 50POS GOLD
| Part | Termination Post Length | Termination Post Length | Current Rating (Amps) | Pitch - Post | Pitch - Post | Contact Material - Mating | Contact Finish - Mating | Contact Finish - Post | Features | Housing Material | Contact Material - Post [custom] | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Termination | Type | Type | Type | Operating Temperature [Max] | Operating Temperature [Min] | Material Flammability Rating | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] | Mounting Type | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Pitch - Mating | Pitch - Mating | Termination Post Length [x] | Termination Post Length [x] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics 50-9508-30 | 0.5 in | 12.7 mm | 3 A | 2.54 mm | 0.1 in | Beryllium Copper | Gold | Tin | Open Frame | Glass Filled, Nylon 4/6, Polyamide (PA46) | Brass | 30 Áin | 0.76 Ám | Wire Wrap | 22.86 mm | DIP | 0.9 in | 105 ░C | -55 °C | UL94 V-0 | 25 | 2 | 50 | Through Hole | 200 µin | 5.08 µm | 0.1 in | 2.54 mm | ||
Aries Electronics 50-9508-20 | 3 A | 2.54 mm | 0.1 in | Beryllium Copper | Gold | Tin | Open Frame | Glass Filled, Nylon 4/6, Polyamide (PA46) | Brass | 30 Áin | 0.76 Ám | Wire Wrap | 22.86 mm | DIP | 0.9 in | 105 ░C | -55 °C | UL94 V-0 | 25 | 2 | 50 | Through Hole | 200 µin | 5.08 µm | 0.1 in | 2.54 mm | 0.36 in | 9.14 mm | ||
Aries Electronics 50-9508-21 | 3 A | 2.54 mm | 0.1 in | Beryllium Copper | Gold | Gold | Open Frame | Glass Filled, Nylon 4/6, Polyamide (PA46) | Brass | 30 Áin | 0.76 Ám | Wire Wrap | 22.86 mm | DIP | 0.9 in | 125 °C | -55 °C | UL94 V-0 | 25 | 2 | 50 | Through Hole | 10 çin | 0.25 çm | 0.1 in | 2.54 mm | 0.36 in | 9.14 mm |