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CONN SOCKET PGA ZIF GOLD
| Part | Contact Finish - Mating | Contact Material - Post | Features | Pitch - Post | Pitch - Post | Material Flammability Rating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Finish - Post | Termination Post Length | Termination Post Length | Mounting Type | Operating Temperature [Max] | Operating Temperature [Min] | Type | Pitch - Mating | Pitch - Mating | Contact Material - Mating | Current Rating (Amps) | Termination | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Gold | Beryllium Copper | Closed Frame | 2.54 mm | 0.1 in | UL94 V-0 | 200 µin | 5.08 µm | Tin | 3.18 mm | 0.125 in | Through Hole | 125 °C | -65 ░C | PGA ZIF (ZIP) | 0.1 in | 2.54 mm | Beryllium Copper | 1 A | Solder | 30 Áin | 0.76 Ám |