SSW-147 Series

Catalog

CONN RCPT 47POS 0.1 GOLD PCB R/A

Part	Pitch - Mating	Pitch - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish - Post	Contact Length - Post	Contact Length - Post	Operating Temperature [Min]	Operating Temperature [Max]	Material Flammability Rating	Style	Fastening Type	Termination	Mounting Type	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Type	Number of Rows	Insulation Material	Insulation Height [z]	Insulation Height [z]	Contact Shape	Current Rating (Amps)	Contact Finish - Mating	Number of Positions Loaded	Contact Material	Insulation Color	Connector Type	Row Spacing - Mating [x]	Row Spacing - Mating [x]	Insulation Height	Insulation Height	Number of Positions
Samtec Inc. SSW-147-02-G-S-RA	0.1 in	2.54 mm	3 µin	0.076 µm	Gold	2.54 mm	0.1 in	-55 °C	125 °C	UL94 V-0	Board to Board Cable	Push-Pull	Solder	Through Hole Right Angle	0.51 µm	20 µin	Forked	1	Liquid Crystal Polymer (LCP)	0.095 in	2.41 mm	Square	4.7 A	Gold	All	Phosphor Bronze	Black	Receptacle
Samtec Inc. SSW-147-21-G-D	0.1 in	2.54 mm	3 µin	0.076 µm	Gold	2.64 mm	0.104 in	-55 °C	125 °C	UL94 V-0	Board to Board Cable	Push-Pull	Solder	Through Hole	0.51 µm	20 µin	Forked	2	Liquid Crystal Polymer (LCP)			Square	4.7 A	Gold	All	Phosphor Bronze	Black	Receptacle	2.54 mm	0.1 in	0.335 "	8.51 mm	94
Samtec Inc. SSW-147-02-G-D	0.1 in	2.54 mm	3 µin	0.076 µm	Gold	4.93 mm	0.194 in	-55 °C	125 °C	UL94 V-0	Board to Board Cable	Push-Pull	Solder	Through Hole	0.51 µm	20 µin	Forked	2	Liquid Crystal Polymer (LCP)			Square	4.7 A	Gold	All	Phosphor Bronze	Black	Receptacle	2.54 mm	0.1 in	0.335 "	8.51 mm	94
Samtec Inc. SSW-147-02-G-D-RA	0.1 in	2.54 mm	3 µin	0.076 µm	Gold	2.54 mm	0.1 in	-55 °C	125 °C	UL94 V-0	Board to Board Cable	Push-Pull	Solder	Through Hole Right Angle	0.51 µm	20 µin	Forked	2	Liquid Crystal Polymer (LCP)			Square	4.7 A	Gold	All	Phosphor Bronze	Black	Receptacle	2.54 mm	0.1 in	0.195 in	4.95 mm	94
Samtec Inc. SSW-147-01-T-S	0.1 in	2.54 mm			Tin	2.64 mm	0.104 in	-55 °C	105 ░C	UL94 V-0	Board to Board Cable	Push-Pull	Solder	Through Hole			Forked	1	Liquid Crystal Polymer (LCP)			Square	4.7 A		All	Phosphor Bronze	Black	Receptacle			0.335 "	8.51 mm
Samtec Inc. SSW-147-02-S-D-RA	0.1 in	2.54 mm			Tin	2.54 mm	0.1 in	-55 °C	125 °C	UL94 V-0	Board to Board Cable	Push-Pull	Solder	Through Hole Right Angle	0.76 Ám	30 Áin	Forked	2	Liquid Crystal Polymer (LCP)			Square	4.7 A	Gold	All	Phosphor Bronze	Black	Receptacle	2.54 mm	0.1 in	0.195 in	4.95 mm	94
Samtec Inc. SSW-147-06-G-S	0.1 in	2.54 mm	3 µin	0.076 µm	Gold	3.15 mm	0.124 "	-55 °C	125 °C	UL94 V-0	Board to Board Cable	Push-Pull	Solder	Through Hole	0.51 µm	20 µin	Forked	1	Liquid Crystal Polymer (LCP)			Square	4.7 A	Gold	All	Phosphor Bronze	Black	Receptacle			0.335 "	8.51 mm
Samtec Inc. SSW-147-02-S-S-RA	0.1 in	2.54 mm			Tin	2.54 mm	0.1 in	-55 °C	125 °C	UL94 V-0	Board to Board Cable	Push-Pull	Solder	Through Hole Right Angle	0.76 Ám	30 Áin	Forked	1	Liquid Crystal Polymer (LCP)	0.095 in	2.41 mm	Square	4.7 A	Gold	All	Phosphor Bronze	Black	Receptacle
Samtec Inc. SSW-147-23-S-T	0.1 in	2.54 mm			Tin	10 mm	0.394 in	-55 °C	125 °C	UL94 V-0	Board to Board Cable	Push-Pull	Solder	Through Hole	0.76 Ám	30 Áin	Forked	3	Liquid Crystal Polymer (LCP)			Square	4.7 A	Gold	All	Phosphor Bronze	Black	Receptacle	2.54 mm	0.1 in	0.335 "	8.51 mm	141
Samtec Inc. SSW-147-02-G-S	0.1 in	2.54 mm	3 µin	0.076 µm	Gold	4.93 mm	0.194 in	-55 °C	125 °C	UL94 V-0	Board to Board Cable	Push-Pull	Solder	Through Hole	0.51 µm	20 µin	Forked	1	Liquid Crystal Polymer (LCP)			Square	4.7 A	Gold	All	Phosphor Bronze	Black	Receptacle			0.335 "	8.51 mm