24-6574 Series

Catalog

CONN IC DIP SOCKET ZIF 24POS TIN

Part	Pitch - Post	Grid Rows	Number of Positions or Pins (Grid)	Grid Columns	Contact Material - Post	Row Spacing	Type	Features	Housing Material	Contact Finish - Mating	Contact Finish Thickness - Mating	Pitch - Mating	Termination	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Mating	Mounting Type	Termination Post Length	Material Flammability Rating	Current Rating
Aries Electronics 24-6574-11	0.1 in	2	24	12	Beryllium Copper	0.6 in	0.6" (15.24mm) Row Spacing DIP ZIF (ZIP)	Closed Frame	Glass Filled Polyphenylene Sulfide PPS	Tin	200 Ąin	0.1 in	Solder	Tin	200 µin	Beryllium Copper	Through Hole	0.11 in	UL94 V-0	1 A
Aries Electronics 24-6574-18	0.1 in	2	24	12	Beryllium Copper	0.6 in	0.6" (15.24mm) Row Spacing DIP ZIF (ZIP)	Closed Frame	Glass Filled Polyphenylene Sulfide PPS	Tin	200 Ąin	0.1 in	Solder	Tin	200 µin	Beryllium Copper	Through Hole	0.11 in	UL94 V-0	1 A
Aries Electronics 24-6574-10	0.1 in	2	24	12	Beryllium Copper	0.6 in	0.6" (15.24mm) Row Spacing DIP ZIF (ZIP)	Closed Frame	Glass Filled Polyphenylene Sulfide PPS	Tin	200 Ąin	0.1 in	Solder	Tin	200 µin	Beryllium Copper	Through Hole	0.11 in	UL94 V-0	1 A