40-6553 Series

Catalog

CONN IC DIP SOCKET ZIF 40POS GLD

Part	Mounting Type	Features	Pitch - Post	Pitch - Post	Contact Finish - Mating	Termination	Number of Positions or Pins (Grid)	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Pitch - Mating	Pitch - Mating	Housing Material	Contact Material - Mating	Contact Material - Post	Current Rating (Amps)	Termination Post Length	Termination Post Length	Contact Finish - Post	Type	Type	Type	Material Flammability Rating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating
Aries Electronics 40-6553-10	Through Hole	Closed Frame	2.54 mm	0.1 in	Gold	Solder	40	20	2	0.1 in	2.54 mm	Polyphenylene Sulfide (PPS) Glass Filled	Beryllium Copper	Beryllium Copper	1 A	0.11 in	2.78 mm	Gold	15.24 mm	DIP ZIF (ZIP)	0.6 "	UL94 V-0
Aries Electronics 40-6553-11	Through Hole	Closed Frame	2.54 mm	0.1 in	Nickel Boron	Solder	40	20	2	0.1 in	2.54 mm	Polyphenylene Sulfide (PPS) Glass Filled	Beryllium Copper	Beryllium Copper	1 A	0.11 in	2.78 mm	Nickel Boron	15.24 mm	DIP ZIF (ZIP)	0.6 "	UL94 V-0	1.27 µm	50 µin	1.27 µm	50 µin